1.Quick turn around, prototypes, volumes 2. 1-36 layers 3. Rigid standard boards, flex- and rigid-flex design 4. Fr-4, cem1, teflon, halogenfree, arlon, metal base, high tg 5. Hdi technology 6. Blind and burried vias 7. Micro via 8. 4 mil structure 9. Surfaces: hal, immersion tin, -silver, -gold, hal leadfree, osp 10. Filled-up vias 11. Impedance controlled boards 12. Manual pcb assembling and smt mounting 13. Qfp, cob, bga etc. 14. Ul, iso, sgs, rohs
