Waterproof Thermally Conductive epoxy resin epoxy encapsulant CAS No.:24969-06-0 Other Names: epoxy sealant MF: mSiO2nH2O EINECS No.: 231-545-4 Place of Origin:Shanghai, China (Mainland) Classification:Double Components Adhesives Main Raw Material:Epoxy Usage:Construction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking, Electronics,ceramics,air filters/steam irons Brand Name: SEPNA Model Number:SE2202 Type:Two Component Name:epoxy encapsulant Mixture ratio: A:B=100:20 Viscosity of mixture:900~1300 Preliminary Cured:4~6 25°C, hours Cure condition:25°C/ 24 hour; 80°C/ 2~3 hour Hardness:>85 Shore D Thermal conductivity: 0.35 W/mK ODM/OEM:Accepted Shipping:By Express(Fedex, UPS ,DHL,TNT) Samples::Free samples Packaging Details:Package for epoxy encapsulant Black/White color Part A-25 KG/Bucket, Part B-5 KG/ Pot Delivery Detail: 10 days