Patent Coulomb-Force E-Chuck (Electrostatic Chuck) : Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents. Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel. Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials. Adsorbable Material (1) Metal conductor (e.g., copper foil) (2) Semiconductors (e.g., silicon, GaAs) (3) Insulators (e.g., paper, glass panel) (4) Porous objects. (5) The adsorption force per unit area is related to the adsorption material and the contact surface smoothness. (6) Material ranking of the adsorption force per unit area is : Metal 1st, Semiconductors 2nd, Insulator 3rd. Operational Environment (1) Atmospheric Pressure. (2) Vacuum Environment. What's Electrostatic Chuck The electrostatic chuck is a device for generating an attracting force between an electrode and an object at a voltage applied to the electrode. Varieties of Electrostatic Chuck (1) Coulomb-Fore Electrostatic Chuck (2) Johnsen-Rahbek Electrostatic Chuck, or JR Electrostatic Chuck Features of Patent Coulomb-Force E-Chuck (1) Coulomb-Force Electrostatic Chuck. (2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.   Main Handling Applications (1) Thin and large size flat glass. (2) Semiconductor thin wafers. (3) Big Size Wafer Handling and Moving. (4) Fragile Warp wafers. (5) Move-Free Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck). (6) Soft copper foil. (7) Soft film. (8) Curved glass. (9) Vacuum Lamination for OLED or Touch Panel. (10) Vacuum deposition. Main Products (Move-Free) Thin Fragile Wafer Supporter 1. Be able to keep adhesion without power source connection. 2. Need connect controller for about 30 seconds to switch the adhesion state. 3. After adhesion setting, move-free supporter can keep adhesion status even disconnecting power. 4. Maximum operating temperature: 250 degrees centigrade. 5. Suitable for soft, thin and fragile object carriers. (Eg, thin fragile wafer, thin glass panel, 4"wafer-on-6"chuck Shape Reinforcement Carrier). (Wired) Stage Holder (Cordless) Palm Other Custom E-Chuck