Thickness: 0.8 to 3.0mm Hole size: 0.1mm (4-mil) (minimum) Line width/space: 0.1mm (4-mil) (minimum) Surface treatment: hasl/ hasl lead-free, lf-hasl, hal, chemical tin, chemical gold, immersion: silver/gold, osp, gold plating High tg and frequency Twist and warp: 0.1mm on integrated circuit parts with so, sop, soj, tssop, qfp and bga Smt: 0201, 0402, 0603, 0805, 1008, 1206 and 1210 Dip pitches through hole down to 0.60mm Solder components to underside of board without disrupting topside Inspection online for aoi and ict test X-ray inspection for bga High-precision e-testing includes ict inline, function test, full experienced qc and qa engineer With rohs directive-compliant Packaging safety