Assembly and disassembly of wide range of smd components from small chips to bgas Microprocessor controlled 3 working modes: Manual Time (according to profile settings) Profile Using outer software it is possible to: Control and edit the soldering/desoldering process save unlimited number of profiles Optimized heating element power and intelligent hot air temperature control almost all smd components can be reworked Wide scale of air flow regulation, starting from soldering with no risk of blowing off the components and soldering paste to large components (also on multilayer pcbs) Built-in vacuum tweezer that can be started manually or automatically safe handling of sensitive components Programming or manual outer system controlling (pcbs pre heater) enables to build a professional smd rework system based on ra-250e Large, contrast display increases comfort of work and keeps the operator updated about current state of all important parameters Adding assembly/disassembly hot air station with pre heater and stand we get advanced work station and possibility to perform works impossible so far to do. Input power: 230 vac Power consumption: 530 w max. Air flow control range: 2-20 l/min, +/10% Temperature control range: 100°c 450°c Vacuum tweezer: 0.2 bar Temperature stability: +/2°c Ext. Dimensions: 200 x 230 x 150 mm Weight: 4.4 kg