Polyimide film Polyimide filmstructure and propertyour polyimide film is high-temperature formed by polymerizing and casting pyromellitic acid dianhydride and 4, 4oxydianiline with dimethylacetamide as an intermedium to form h-grade insulating film. Polyimide film is widely used for electrical and electronic appliances with properties of heat resistance , chemical resistance(almost no organic or inorganic solvents except for caustic alkali), dielectric, flame retardant, physical, mechanical and compounded with many materials performances.Its properties as below: Size: thichness0.025-0.125mm, width16-1040mm Specifications: 1) Physical and chemical performance: A. Thickness tolerance: 10%, B. Density: 1.40-1.44g/cm3, C. Tensile strength: lengthwise 145mpa, crosswise 130mpa D. Elongation (lengthwise/crosswise): (60%2) dielectric performance: A. Dielectric strength: 150kv/mm, B. Dielectric coefficient: 4, C. Tangent of dielectric loss angle: 0.004, D. Volume resistance: 1010 , surface resistance: 1013. 3) Heat resistance performance: A. Melt point : without, B. Heat shrinkage (at 200centigrade): 0.4%, C. Flammability: difficult to burn, self-quenching. D. Thermal resolution temperature: 470.4) chemical resistance:with strong corrosion resistant capability, our polyimide film can withstand the solution of any organic solvent. Except for caustic alkali, no any inorganic acid and alkali can make up corrosion on the film but a little boss in mechanical strength may be performed.Uses: extensively used in the field of space flight, aeronautics, navigation and nuclear industry, also used in traction motor of locomotive, diving oil motor and various h-grade high temperature-resistant motor for mine, capacitor, as well as wrap insulation for high temperature cable, electromagnetic line, and can make composite film, flexible copper-metallized plate, flexible printing board etc. Rolls in carton with plastic foam as liner