PHONEFIX Heating Station + 3 kinds Motherboard Heating groove:
120X-MAX ( 3-IN-1 ) for phone X / XS / XS MAX Double Layers Board Pre-heating Rework Station
120C - for phone 5 6 7 8 motherboard Desoldering Rework Station
120CC - phones motherboard Desoldering pre-Heating Rework Station

Feature:
Brand: PHONEFIX
Voltage: 110V / 220V
Demolition shield temperature adjustment 180â??-220â??
In addition to CPU side glue temperature 180â??-220â??
Demolition A8 A9 A10 A11CPU the temperature 230â??-240â??
Desmearing temperature 180â??-200â??
Reball BGA chip temperature 180â??-200â??
Soldering A8 A9 A10 A11 CPU temperature 190â??-210â??

phone 6 6S 7 8 / X XS MAX Double Layers Board Pre-heating Desoldering Rework Station, adopt special heating design and precise temperature control capability, which will locate accurately locate the needed heating part. Using high purity copper to guarantee heat transfer, which is not easy for deformed, durable and anti-wear