Resin bond diamond Internal Diamond Grinding Wheel for HVOF coating
Description of the Resin bond diamond Internal Diamond Grinding Wheel for HVOF coating:
Resin bond diamond internal grinding wheels are mainly used for grinding tungsten carbide coating, ceramic coating, and other materials
Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes, dish shapes, etc.
Feature/Benefit of the resin bond diamond interal grinding wheel
1. Good free-cutting
2. Good Abrasion Resistance
3. Availability in a broad range of applications in both Dry and Wet Condition
4. Improved Heat Resistance
Application of the Resin bond diamond Internal Diamond Grinding Wheel for HVOF coating:
1. Internal grinder,
2. Tungsten carbide grinding,
3. Wet or dry grinding
Specification of resin bond diamond internal grinding wheel:
Type: 11,18, 11W
Bond type: Resin, electroplated, metal type
Grit: 50 2000
Concentration:100,125
to meet your requirements in every way, we need the following information
Shape and Dimension of the wheels
Grit size (Mesh, refer to Table 1)
Concentration
Bond(Resin, Vitrified, Metallic, Electroplated)
Quantity