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Dec-14-21

Ph2.5Mm(0.1") Wafer, Board To Wire, Wire Harness

(1.0)

Kunshan Connector Electronics Co., Ltd.

Suzhou, Jiangsu, China

SPECIFICATIONS: Current Rating:3.0 A Insulation Resistance:1000M Min Dielectric Withstanding:1000V AC Contact Resistance: 20m Max Operating Temperature:-25 to +85 MATERIALS: Contact Material: Phosphor Bronze Insulation Material: High Temperature Thermoplastic Finish: Tin Plated

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Sending Inquiry For: Ph2.5Mm(0.1") Wafer, Board To Wire, Wire Harness

Ph2.5Mm(0.1") Wafer, Board To Wire, Wire Harness

Kunshan Connector Electronics Co., Ltd.