Brief description
The RS-UV3C series UV laser marking machine is catering to the demand for marking and surface treatment of various glass, TFT, LCD screen, plasma screen, textile, thin ceramic, single-crystal silicon wafer, IC crystal, sapphire, polymer film, and other materials. The machine has stable performance, small size, low power consumption, high positioning accuracy, high operating efficiency, and modular design for easy installation and maintenance.

Advantage:
High beam quality, very small light spot, capable of ultra-fine marking
The heat-affected area is very small, there will be no thermal effects, the material is not deformed or burnt, the marking effect is fine and repeatable, and the high-precision and high-precision light spot guarantees the marking result. The marking process is non-contact and the marking effect is permanent.
Optional two-dimensional automatic worktable to achieve continuous multi-station marking or large-format marking, which can be coordinated with the production line, automatically loading and unloading, and automatic feeding and discharging.
The flexible and convenient operating system, humanized operation process, the special control software can realize automatic arrangement and modification of seat symbols, graphic images, bar codes, two-dimensional codes, serial numbers, etc .; support PLT, PCX, DXF, BMP, JPG and other File formats, can use TTF font directly, CCD automatically recognizes and tracks.
The marking lines are very thin, which is suitable for occasions with high marking requirements. It is mainly used for fine marking on the surface of LCD screens, lenses, ICs, and other products.

Typical application
Marking for 3C industry
Industrial micromachining
LED scribbling
Laser rapid prototyping
Silicon wafer processing
Electronic Components Engraving
PCB drilling or cutting
FPC cutting
Film etch
Glass marking
Wafer saw