This type of membrane switch uses silver paste as the upper circuit layer of the switch. By pressing, the center of the silver paste point is connected to the lower circuit to realize the conduction and trigger signal. Through the "die-pressing" , the silver paste disk of the button of the upper circuit is pressed into a certain spherical crown shape with a mold, and a certain elasticity is generated, so that the button can rebound when pressed, and the circuit is turned on or off. It is also obvious enough to feel the switch closed. Bumping of silver paste requires the use of molds, especially batch orders, and the need to customize the bumping molds can greatly improve the production efficiency and the stability of product quality.

The die-pressing silver pad can be designed to be 5mm-11mm, and the recommended size is 8-10mm. The button size will be more suitable for finger pressing.