Rigid Flex Printed Circuit Boards: Layers : 4 Layer PCB Material: FR4 High Tg and polyimide Board Thickness: 1.6mm Surface Finishing: ENIG Finished Copper thickness: 1/1/1/1 OZ Special Process: Rigid-Flex PCB Rigid-Flex PCB Capability: Minimum Circuit Trace Width/Space: 2.7/2.7mil The Minimum Via Size : 0.15mm The Minimum legend Height/Width: 0.5mm/0.12mm Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide Maximum Panel Dimension: 1200mm x 600mm Final Board Thickness: 0.4mm ~ 6.0mm Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm Solder Mask Colour: Green White Black Red Blue Yellow Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole