We are specializes in the manufacture of a wide range of board types. The emphasis on R&D has helped us become a market leader in the development and manufacturing of advanced PWBs. Our capabilities enable us to offer: Rigid boards up to 42 layers Flex and Rigid-Flex boards up to 40 layers Hybrid solutions for Microwave/RF applications Thermal and signal integrity management solutions, employing coins and cavities 2D or 3D heat-sinks: Copper and Aluminum Carbon printing HDI blind, buried, staggered & stacked vias Buried passive components: capacitors and resistors In-house HATS lab