We are specializes in the manufacture of a wide range of board types. The emphasis on R&D has helped us become a market leader in the development and manufacturing of advanced PWBs.
Our capabilities enable us to offer:
· Rigid boards up to 42 layers
· Flex and Rigid-Flex boards up to 40 layers
· Hybrid solutions for Microwave/RF applications
· Thermal and signal integrity management solutions, employing coins and cavities
· 2D or 3D heat-sinks: Copper and Aluminum
· Carbon printing
· HDI blind, buried, staggered & stacked vias
· Buried passive components: capacitors and resistors
· In-house HATS lab
Please ask detailed and specific
questions about Pricing, Minimum Order Quantity, Delivery Timelines etc. Detailed Messages
result in prompt responses.
