Eelectroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap), Oxide Wafers (LiTaO3), Optical Glass. Details Electroformed hub dicing blade is made by using an ultra-thin diamond wheel and a high precision aluminum alloy hub. Applications Of Hub Dicing Blade Cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap), Oxide Wafers (LiTaO3), Optical Glass The Features Of Hub Type Dicing Blade * Improving balance between blade life and processing quality (in particular backside chipping) * Strengthens rigidity, Reduction in wavy cutting and blade wear under high load conditions * Precise control of diamond grit size, diamond concentration, and nickel bond hardness to reduce splitting on the edges * Realizes high speed wafer cutting after laser grooving