Gold OSP 6 layers mobile phone circuit board Gold OSP circuit board 1) Thickness: 0.1mm-5mm 2) Minimum linewidthï¼?0.075mm/3mil 3) Minimum gapï¼?0.065/2.8mil 4) Minimum aperture inradiumï¼?0.15mm 5) Minimum aperture external diameterï¼?0.45mm 6) Minimum BGA: 0.2mm 7) Layerï¼?6 layers through hole non-impedance All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.
