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for remove back glass and middle frame for remove back glass and middle frame for remove back glass and middle frame

It suitable for repair back glass. Like iphone8/x ect. and separate middle frame for all flat screen. It can automatic adjust height and align. No need ruler.

Back-cover separating machine is the newest machine designed specially for back-cover separating. With this machine, there is no need for us to disassemble the whole phone to repair glass back cover anymore. We are the first manufacture who is able provide the laser back cover separating machine with precise positioning.

Many New popular mobile phones on the market both the front and back cover are glass,the back glass is fragile and extremely difficult to repair.and We launched a new machine,It can separate midframe/bezel/back glass of more than 50 smartphone models, including iPhone X/8 Plus/8 in a safe and quick way.

2021 Newest TBK-958M Mini Laser Separating Engraving Machine For Phone & Tablet Screen/Back Glass Repair With Automatic Fixture. Main Features: 1. Harmful fume or gas is always generated when welding or soldering for repairing the PCB, the machine can absorb the harmful smoke, fume or gas effectively. 2. Optionally and very suitable working with TBK-958A/958B/958C laser marking machines. 3. 360 degree bending direction adjustment. 4. 108cm flexible long pipe, no need external force. Small size 36.5*23*42cm, Light Net-weight 6.0 kgs; The max height of the engraved object is 55mm, and marking range 175Ã??175mm. Independently researching and developing the Optical path; Integrated-power mini laser, equipped with upgrading data in cloud; Imported sensor auto focus and imported high precision calibrator; External computer; one-button focus, one-button starts, simple operation.

2021 Newest TBK-958M Mini Laser Separating Engraving Machine For Phone & Tablet Screen/Back Glass Repair With Automatic Fixture. Main Features: 1. Harmful fume or gas is always generated when welding or soldering for repairing the PCB, the machine can absorb the harmful smoke, fume or gas effectively. 2. Optionally and very suitable working with TBK-958A/958B/958C laser marking machines. 3. 360 degree bending direction adjustment. 4. 108cm flexible long pipe, no need external force. Small size 36.5*23*42cm, Light Net-weight 6.0 kgs; The max height of the engraved object is 55mm, and marking range 175Ã??175mm. Independently researching and developing the Optical path; Integrated-power mini laser, equipped with upgrading data in cloud; Imported sensor auto focus and imported high precision calibrator; External computer; one-button focus, one-button starts, simple operation

Back-case separating machine is the newest machine designed specially for back-cover separating. With this machine, there is no need for us to disassemble the whole phone to repair glass back cover anymore. We are the first manufacture who is able provide the laser back cover separating machine with precise positioning.

PCB Laser Depaneling, SMTfly-5LI Description: With the advent of new and high power plus lower cost UV lasers there is greater adoption of cutting of materials like printed circuit boards. This boards may be produced from fiber glass materials like FR4 or for thin flexible circuits they may be fabricated from polyimide or kapton. This process can now be handled easier and at higher throughput with lasers. Previous issues like jutting metal tracks can be minimized and there is minimal charring or heat affected zone. This provides a new method to the industry and is especially useful for low volume, high mix production and also for prototyping or engineering production as there is no need to invest in making mechanical die sets. As the laser is far more stable and durable then mechanical punch or cutter it is easier to ensure long term good product cut quality. And the laser can be programmed easily to cut infinite patterns so there is no mechanical die making cost and lead time is almost instantaneous. With thicker materials like FR4 high power UV laser can cut thicker boards with minimal charring and HAZ. As laser cutting does not induce mechanical stress or disturbance compare to mechanical cutting, drilling, routing and other contact type methods, path can be cut nearer to active areas besides reducing board thickness thus shrinking PCBs. Other advantages are no constrain on board complex shapes, less likely manufacturing defects, easier fixturing and lending the process to automation. Features: Pre-camera vision product position registration and model check Optowave UV laser head High capacity dust collector User friendly Window based software PCB flexible product jig adjustable for different board size High resolution and accurate Z stage with auto-focus function Large area low friction front loading platform for sliding multiple product jigs Fully covered class 1 safety enclosure Able to do cutting and marking together Compact size Specification: Laser Q-Switched diode-pumped all solid-state UV laser Laser Wavelength 355nm Laser Power 10W/12W/15W/18W@30KHz Positioning Precision of Worktable of Linear Motor ±2μm Repetition Precision of Worktable of Linear Motor ±1μm Effective Working Field 460mmX460mm(standard) Laser Scanning Speed 2500mm/s (max) Galvanometer Working Field Per One Process 40mmÑ?40mm

PCB separator, PCB laser machine.

Laser separator machine, oca laminating machine, , manual separator machine, , 7"semi-automatic lcd remover, , 14" manual lcd remover.