The Sunkye family of TwistPin equipped Micro-D subminiature connectors to offer outstanding mating performance, durability, and minimal contact resistance. Sunkye Microminiature-D Connectors feature high-density micro TwistPin contacts set on 1.27mm centers in arrangements from 9 to 130 contacts. They are available with insulated and uninsulated wire, PCB, solder cup and flex terminations and are supplied as MIL-DTL-83513 or commercial variations. Our mil dtl 83513 connectors and COTS connectors provide a reliable solution for all high-performance interconnect requirements Description of MIL-DTL-83513 connector By its very design, the Micro-D type connector system meets all the requirements of robustness, durability, low contact resistance, high current, dielectric strength, shock, and vibration. With 1.27 mm (.050") contact spacing, micro d subminiature, half the size of D type connectors (D series connectors), represent an excellent solution for saving both space and weight. In addition to a complete range of micro d subminiature connectors to 83513 d sub vs micro d, Sunkye also offers Micro-D PCB connectors and cable assemblies in both metal and plastic bodied versions. With its many possible configurations, the technology of micro electrical connectors is perfectly suited to a multitude of systems where weight, miniaturization or signal transmission integrity is paramount: applications benefiting from this technology include everything from missiles and their guidance systems, through oil well drilling tools to medical devices, satellites, and scientific research. For very specific applications such as medical MRI scanners or low magnetic field detection systems, Sunkye has developed a range of non-magnetic connectors using new materials and surface treatments, avoiding ferromagnetic materials. Hermetic micro d connectors are also offered for applications where an enclosure needs to be fully sealed from the outside world.
In addition to the standard range of Micro-D connectors and assemblies, Sunkye is able to offer small electrical pin Nano-D connectors and assemblies based on the highly reliable Twist Pin contact technology. Different types of MIL-DTL-32139 Nano D Connectors Description of MIL DTL 32139 Nano D Connector MIL-DTL-32139 Nano D sub connector are ideal solutions for applications including aerospace, military, industrial, medical or off-shore which require extreme miniaturization, space or weight saving and reliability. Sunkye's nanoconnectors meet the requirements of MIL-DTL-32139. The Twist Pin contact of mini d connector by its design and performance enables the system to meet the most severe requirements of ten significantly more so than stipulated in the MIL-DTL-83513 and MIL-DTL-32139 standards. The male Micro-D contact is made up of 10 strands of beryllium-copper and copper alloy twisted together, welded then bumped. These sprung strands are in fact compressed during insertion into the turned female contact and therefore a high number of electrical contact points are permanently assured while retaining flexibility and ease of insertion/extraction. The bulged point will be compressed inside the socket during insertion. Insertion and retention performance of the twist pin and socket mated pair. Both socket contact chamfer and twist pin hemispherical radius contribute to ensuring adequate insertion even in case of misalignment. As a professional nano connector supplier, Sunkye offers top-quality nano connectors for sale. Feel free to contact us for more information.
Micro Wire Backshell Connector for Choice Description of Micro Wire Backshell Connector Different backshell types are available for Split EMI/RFI/filter or accommodate larger wire bundles or screw locks allowing the connectors to be fully mated before the hardware is fastened, or for wire or cable strain relief, Sunkye Mil DTL 83513 backshell electrical connectors provide perfect performance, which widely used in military area, aerospace, aviation, electricals hip-building, defense system, etc. MICRO-D EMI BACKSHELL of Wire Backshell Connector Micro-D aluminum backshell for EMI termination. Supplied with stainless steel hardware. Various entry sizes & shapes. Available for standard and micro termination. Shell size from 9 to 100. Removable jackscrews according to MIL-DTL-83513/05 For pigtail crimping & solder cup connectors only. 2 sizes of hardware: one version for shell sizes from 9 to 69 ways and another version for the 100-way shell size. 1 kit consists of 2 screws and 2 e-rings. Hex socket head or slot head. Material: passivated 300 series stainless steel Contact arrangements of Micro D Backshell Connector Metal shell: 9, 15, 21,25,31,37,51,66,74, 100 contacts Plastic shell: 9, 15, 21,25,31,37, 51 contacts Introduction of Micro D Wire Backshell Connector Series * Micro D Connector Terminal Mounting * Crimping connector Contacts *Twist pin contacts, high density interconnection, Beryllium copper (BeCu), gold over nickel plating The thickness of Gold plating * â?¥1.27micron TWIST PIN * Male contact, fitted to plug connector. Socket * Female contact, fitted to socket connector (also known as socket). Insulator* 20% GFPPS (20% glass filled polyphenylene sulfide) Insert * Moulded insulation housing, separating each connection. Interfacial Seal * Fitted to socket connector only Shell *Connector metal body plated nickel or cadmium. Jackscrew *High or low profile, hexagonal socket or slotted head. Jackpot* Mates with jackscrew. LCP * Liquid Crystal Polymer. Potting * Epoxy compound used as an encapsulant. Cable * AFR250 (PTFE) MIL-DTL-681 Wire length * â?¤6 meters (Recommend) Standard connector * Manufactured to the standard dimensions and specifications. Special connector * A standard connector modified to meet specific requirements. Custom-made connector * Designed to meet specific customer requirements. Pigtail connector * Connector with insulated or uninsulated wires. Harness * Multi-branched cable assembly. Sunkye International was originally developed in the early 1950s and was one of the Twist pin/ Micro D/Nano D connector companies to license this technology and improve it.
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