With is high spatial resolution, this product allows mapping for metal contamination in the wafer. It realizes user-friendly structure through automation. It minimizes the maintenance and management cost by using a small amount of chemicals. With its short analysis time and mapping capacity, this product contributes to the improvement of productivity and yield through prompt response and prior detection to problems that occur in the process.
It is the equipment to provide the electron beam vertically to the evaporate surface using the electron beam gun, and it is used in the process of optical multi-layer films This is the process micro electro mechanical system (MEMS) known as the electron beam evaporation process Physical Vapor Deposition (PVD) The deposition process is used to open the data in the source and send those data to the basal board and also to form thin films or coating. Because this is inexpensive regarding the material cost and exhibits rather low process risk, PVD process is the chemical vapor deposition generally used for metal eposition. The process applying the deposition of thin films conducts modification with various kinds of surfaces wanted by the industry in order to provide data to the electronic industry for semicon doctor growth, reflection needing properties to the aerospace, environment to the permeability optics, surface protection from the board corrosion, and also thermal and chemical barrier coating.
Vacuum degassing chamber.
It is easy to use for the automation of analyzing processes. The overall efficiency of analysis increases with shortened time for analysis. The buffer zone keeps the process zone vacuum all the time, so the inflow of dirty gas from outside is minimized and the precision of analysis becomes maximized. Keeping the process zone vacuum delays the aging of heater components more than before, so it is good for cost reduction. The automation of analysis processes maximizes the utility of time of testing manpower. Minimizing the contact of samples for analysis to the outside minimizes contamination. The increase of analysis efficiency actualizes the dedtion of faultiness in advance, so it is possible to test the processes.
With is high spatial resolution, this product allows mapping for metal contamination in the wafer. It realizes user-friendly structure through automation. It minimizes the maintenance and management cost by using a small amount of chemicals. With its short analysis time and mapping capacity, this product contributes to the improvement of productivity and yield through prompt response and prior detection to problems that occur in the process.
Vacuum chamber.
Espec chamber.
Uhv chamber.
It is the equipment to provide the electron beam vertically to the evaporate surface using the electron beam gun, and it is used in the process of optical multi-layer films This is the process micro electro mechanical system (MEMS) known as the electron beam evaporation process Physical Vapor Deposition (PVD) The deposition process is used to open the data in the source and send those data to the basal board and also to form thin films or coating. Because this is inexpensive regarding the material cost and exhibits rather low process risk, PVD process is the chemical vapor deposition generally used for metal eposition. The process applying the deposition of thin films conducts modification with various kinds of surfaces wanted by the industry in order to provide data to the electronic industry for semicon doctor growth, reflection needing properties to the aerospace, environment to the permeability optics, surface protection from the board corrosion, and also thermal and chemical barrier coating.
DC magnetron sputter system.
Loading Capacity (kg) 250~300 500~600 Liquid Quantity (liters) 1,500~2,100 3,000~4,200 Electric Power (kW) 26.9 44.1 Installed width (mm) 2,300 3,500 Length (mm) 9,000 9,000 Height (mm) 1,920(3,100) 1,920(3,100) Max. operating temperature 140 Heating rate (Saturate Steam 0.7 Approx. 20min (from20 to140) Cooling rate (Cooling Water 0.1 15) Approx. 15min (fom140 to 80)
Loading Capacity (mm) 2,000 2,000 Liquid (mm) 1,100 1,100 Electric Power (kW) 13 13 Installed width (mm) 3,730 3,730 Length (mm) 2,400 2,400 Height (mm) 2,600 2,600 Max. operating temperature 98, Heating rate (Saturate Steam 0.7) Approx. 20min (from20 to 98)
Loading Capacity (kg) 200 400 Liquid (liter) 1,800~2,200 4,500~5,500 Electric Power (kW) 7.5 15 Installed width (mm) 5,000 5,100 Length (mm) 2,000 2,900 Height (mm) 2,500 3,400 Max. operating temperature 140 Heating rate (Saturate Steam 0.7) Approx. 20min (from20 to 110) Cooling rate (Cooling Water 0.1, 15) Approx. 30min (from110 to 80)
Loading Capacity (kg) 200 Electric Power (kW) 42.5 Installed width (mm) 3,000 Length (mm) 9,500 Heigth (mm) 3,500 Max. operating temperature 120 Heating rate (LNG) Approx. 20min (from20 to120) Cooling rate (Cooling Water 0.1, 15) Approx. 20min (fom120 to 80)
Loading Capacity (kg) 150~200 300~400 500~600 Liquid (Liters) 1,200 2,400 3,500 Electric Power (kW) 10(14) 19(26) 23(26) Installed width (mm) 2,000 3,100 3,100 Length (mm) 5,300 5,300 5,900 Height (mm) 3,700 3,700 3,700 Max. operating temperature 98 Heating rate (Saturate Steam 0.7) Approx. 15min (from20 to110) Cooling rate (Cooling Water 0.1, 15) Approx. 20min (fom110 to 80)
Cloth length (m) 5 Liquid Volume (liters) 600 Electric Power (kW) 10 Installed width (mm) 3,200 Length (mm) 2,025 Height (mm) 1,850 Roller Width (mm) 2,000
Power : 3 phase Ac 220v Measure : 1550 x 2300 x 1420 (width*length*height) Weight : 900kg Servo axis : 6 axis Bending capacity : soft wire (2.5~7.0) Hard wire (1.8~4.0)
NM35 spring forming machine.
Power : 3 phase Ac 220v Measure : 1550 x 2300 x 1420 (width*length*height) Weight : 900kg Servo axis : 6 axis Bending capacity : soft wire (2.5~7.0) Hard wire (1.8~4.0)
Loading Capacity (kg) 100~200 200~400 300~600 Liquid Quantity (liters) 1,000~1,400 2,000~2,800 3,000~4,200 Electric Power (kW) 19.5 36.4 53.6 Installed width (mm) 2,000 3,000 4,000 Length (mm) 10,700 10,700 10,700 Height (mm) 1,600(3,000) 1,600(3,000) 1,600(3,000) Max. operating temperature 140 Heating rate (Saturate Steam 0.7,) Approx. 20min (from20 to140) Cooling rate (Cooling Water 0.1,, 15) Approx. 15min (fom140 to 80)
