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Wanted : Plating Equipment

Buyer From Japan
ARCHIVED
  • Destination: Japan
  • Date: Jan 31, 2022
  • Target Price: Negotiable
  • Quantity Required: Not specified by buyer
  • Payment Terms: To be discussed with suppliers
  • Shipping Terms: FOB
  • Looking for suppliers from: Worldwide
Product Description:
Buyer is interested to receive quotations for the following RFQ -

Product Name: Plating Equipment

Specifications:
- Equipment to efficiently advance the plating process on large amounts of material, or on materials that are difficult to plate on.
- Copper electroplating machine for layering PCBs
- Size: Standard
- Standard and technical specifications

Quantity Required : MOQ

Contact : Takahiro

 
 
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