Multi touch screen, blackboard, whiteboard, seamless blackboard, multi touch transparent screen, video wall, kiosk, smart tv, monitor.
Micro sd memory cards.
SD supplier, Micro SD.
Memory card.
LED lamp, LCD, opto-electronic component, laser diode, LCD backlight.Design, manufacture and distribute LED & LCD
Varistor, PTC thermistor, MLCC, capacitor, fitness equipments.
Lighting, electronic products.
USB duplicator, SD card duplicator, HDD/SSD/PCIe duplicator..
Electronic Components.
Accessories for electric motors, electrical transformers, high power semiconductors such as diodes, thyristors, bridge rectifiers, power modules.
Bridge rectifier, GPP rectifier, zener chip, IGBT, schottky diodes, MOSFET, TVs.
Bridge rectifiers, diode, transistors, ICS, battery, auto rectifiers.
Fire alarm control panel, public address system, fire fighting equipment, fire alarm, detector.
Electronic parts scrap, motherboard, HD, ram, power supply.
Consumer products like electronics items ranging from led tv, tablet pc, smart watches.
Transistor, mosfet, crystal , oscillator, resonator, MLCC, diode, tantalum chip capacitors, bead.
Cable assembly, wire harness, mobile phone wire harness, car cable assembly, crimping tool, pneumatic crimping tool, stabilizer.
DRAM modules, memory computer related, power supplies, design and custom power supplies, scrap electronic materials.
GPS, GNSS receiver module, GPS, gnss antenna, RF antenna, quartz crystal unit, crystal clock oscillator, TCXO, VCXO, OCXO, saw, ceramic resonator & filter, MCF.
Coptics is dedicated in development of smart card and rfid solution product since 2009. Our products have been well field proven by customers worldwide. We address both contacted and contactless smart card chips, module and solution. The contactless solution include hf (13.56mhz) and uhf (960~928mhz) smart card and rfid products. Nfc tag(near field communication) is one of latest product introduced to market for market demand as nfc has becomed standard function of smart mobile phone. We can offer tag chip (in die form or bumped die or moduloe or standard dfn package with field detection pin), antenna ref design and inlay. The chip is designed by shanghai giantec-semi inc who was spun off from issi (us nasdaq issi) in 2010. They deliver more than 100m unit per quarter on smart chip for transportation, id, sim, e-purse, surveillance, member card applicaiton. We work with them to serve for world wide customer since 2009.
