Oxidized Bitumen, Asphalt, Bitumen.
Zinc, Nickel, Copper, Tin, Lead Ores.
Pure magnesium, high purity magnesium, magnesium alloy ingots, magnesium alloy chips..
Tantalum scrap, niobium or tungsten, molybdenum scrap, molybdenum scrap, tantalum scrap.
Oil, butyl rubber bk 1675, bromo butyl rubber bbk 239, carbon black (n220, n330, n339, n550 & n660), di ethylene glycol (deg) , dea, epdm, iso butanol, meg, mea, methanol, n butanol, nbr, paraffin wax, pbr nd & skd ef, sbr 1500, sbr 1502 & sbr 1712, sulfur powder & sulphur, teg, tea, ferric chloride, calcium chloride, magnesium chloride, ammonium chloride, bleaching powder (commercial grade), bleaching powder (industrial grade), sodium hypochlorite, liquid chlorine, caustic soda (50% liquid), caustic soda (solid), caustic soda (flakes), nickel chloride, hydrated lime.
Micro SIM CARD Push Push Type 6PIN w/SW Material : - Insulator : High Temperature Thermoplastic, UL 94V-0. - Contact : Copper Alloy - Shell : Stainless Plating : - Contact : Plated 30u" Ni Overall Contact Au 1U - Shell : plated 30u" Ni Overall - Plated 1u"Au Selective Contact Area Electrical : - Current Rating : 0.5mA AC/DC max. - Voltage Rating : 125V AC/DC - Ambient Temperature Range : -20~+60 - Storage Temperature Range : -40~+70 - Ambient Humidity Range : 95% R.H. Max. - Contact Resistance : 100m max. - Insulation Resistance : 1000M min./500VDC
Copper-wires, copper alloy wire, tinsel wire, copper tinsel wire, lead wire, conductor.