Bling bling nude nail glass nail shiner: Dains products are crystal clear and shiny without manicure. It lasts for up to 4 weeks. It is easy to use and convenient, and is excellent in all aspects of sustainability, economy and stability. Specifications: - size: 13mm x 88 mm x 3mm - package size: 85mm x 168 mm x 11mm - 1 product + 1 case - storage case with basic size - easy to carry
Dahvit crystal nail glass nail shiner: Dains products are crystal clear and shiny without manicure. It lasts for up to 4 weeks. It is easy to use and convenient, and is excellent in all aspects of sustainability, economy and stability. Specifications: - size: 14mm x 117 mm x 3mm - package size: 75mm x 193 mm x 11mm - 1 product + 1 case - large size product for more efficient operation
Lead Acid Battery Scrap..
Water purifier, aluminum pfc tube, aluminum header pipe, pe breathable/non breathable film.
Valve, cable & wire, electronic component, transmitter, isolator, thermometer, hygrometer.
Sports shoe, soccer shoe, football shoe, baseball shoe, golf shoe, skateboard, snow boots, special working shoe, sandal and slipper, canvas� shoe, dress shoe, safety wear shoe, mountain shoe.
Plastic squeeze tube, empty plastic tube, cosmetic packaging.
Plastic injection mold maker, molds for automobile and pallet and box and tv .
Synthetic orthopedic casting tape & splint and under cast pad, casting equipment, casting resin, metal adhesive.
Hand Sanitizers, Disposable Medical Protective Gowns, Goggles, Gloves And Other Anti-virus Products.
Dc motor plc magnet braker.
Industrial Filter, Spare Parts For Daewoo, Hyundai Truck And Bus Others.
The Dumbbell style elements, with the enlarged cold ends, were one of the earliest designs of the heating elements, which were originally made oversized to increase the cold end cross section, lowering electrical resistance so as to lower the operating temperature of the cold ends. Following should be provided when inquiring or ordering DB (Dumbbell) Silicon Carbide Heating Elements: Type: DB Outer Diameters: of the Hot Zone (D1) and of the Cold Zone (D2), mm Length: of the Heating Section or the Hot Zone, HZ, mm Length: of the Cold Zone, CZ, mm Overall Length: OL, mm Example: Type DB, D1/ D2=18/28mm, HZ=300mm, CZ=350mm, OL=1000mm, Resistance 1.70�© Specified as: SPK DB18/28/300/350/1.70
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
SI wafer Dicing Saw Blade Produce Vitrified,Metal,Resin,Blade that efficiently cut various Materials- silicon Wafer,Sapphire,alumina,LCD or electronic Parts with Precision and excellent efficiency Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process.
Sapphire Wafer Back Grinding Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel Usage of the products : Sapphire Wafer - Wafer Thinning Processing Back Grinder Wheel. Grinder Wheel for LED Process: Grinder Load Reducing Design: -Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface - Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design. Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality. Wheel Life Time Easy adjusting design with priority in quality.
Sapphire Ingot C Surface Cutting Saw or Grinder Cup Wheel - Sapphire Boule Processing Cup wheel -Core Drill for Ingot -Flat surface Grinder Wheel -Sapphire Wafer Grinder Wheel Usage of the products : Sapphire Ingot: Sapphire Boule C Standard Surface Processing Cup Wheel - Ingot Core Processing Core Drill - Ingot C Surface Flattening Cup Wheel - Ingot Cylinder Grinder Cup Wheel Grinder Wheel for LED Process: Grinder Load Reducing Design: -Wafer Damage(Down) with Efficient Wheel Blade wafer Touch Surface - Efficient Grinder heat radiation with Wheel blade cw direction diagonal model design. Sapphire Wafer friendly Wheel design-Wheel design with priority in product Quality. Wheel Life Time Easy adjusting design with priority in quality.
Resin Bonded Wheels is manufactured by mixing synthetic resin (phenol and Polyimide) and fillers super abrasive materials. Usage of the product: Resin Bonded Wheels can be effectively used in the brodest range of appliances. Resin Bonded Wheels can be designed for both wet and dry grinding modes.
Vitrified Bonded Wheels is very fragile as a mixture of glass materials is used. It is more excellent in bonding. Strength than the Resin bond. It can adjust its strength and chip discharging function by changing its porosity and Structures.
Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
