We can provide OINP (Over Issued Newspaper / Newsprint) waste paper CLEAN QUALITY WITHOUT SHORTAGE. 40MT~60MT BULK QUATITY AVAILABLE ORIGIN : SOUTH KOREA If you are Interested we can Supply as Bulk Quantity For more Detailed, Please cntact with us
We can provide OINP (Over Issued Newspaper / Newsprint) waste paper CLEAN QUALITY WITHOUT SHORTAGE. 40MT~60MT BULK QUATITY AVAILABLE ORIGIN : SOUTH KOREA If you are Interested we can Supply as Bulk Quantity For more Detailed, Please cntact with us
We can provide OINP (Over Issued Newspaper / Newsprint) waste paper CLEAN QUALITY WITHOUT SHORTAGE. 40MT~60MT BULK QUATITY AVAILABLE ORIGIN : SOUTH KOREA If you are Interested we can Supply as Bulk Quantity For more Detailed, Please cntact with us
We can provide OINP (Over Issued Newspaper / Newsprint) waste paper CLEAN QUALITY WITHOUT SHORTAGE. 40MT~60MT BULK QUATITY AVAILABLE ORIGIN : SOUTH KOREA If you are Interested we can Supply as Bulk Quantity For more Detailed, Please cntact with us
Floor heating systems of heating cable, mat cable, heating pipe, heating film, snow melting cable, thermostat.
Home fabric / wallpaper/ vertical blind design. Monopoly design. 100% polyester Ef velvet tricot burn out fabric.
Coffee vending machine, coffee mix powder, maxwell coffee, paper cup.
Heat transfer printing narrow febric.Export
Textile fabrics, fresh and stocks lot from korea, onip, over issued news paper, second hand used textile machines dealer.
Sub parts for air conditioner.
Over Issued Newspaper And Iron And Steel Remaltable Scrap.
Heat transfer printed narrow fabrics, army camouflage belts, fashion belts, shoelaces, hanger, accessory, strap.
Booklet, paper box, paper bag, catalog, leaflet, pamphlet, poster, package, mask(kf 94).Shipping
Knitting Needle & Parts, Circular M/c Needle & Parts, Transfer M/c Needle & Parts.
Menu: 3 kinds of premix Canister capacity: 1.6kgs Cups capacity: 62 cups Water capacity: 2.7 liters Features: Adjustable granules level Adjustable water level Adjustable pricing Accurate inventory system Adjustable temp level Anti-repellant system With auto-clean system Low cost electricity (w/ auto-shutdown system) L 55cm. X w 36cm. X h 71cm., 16kgs
With is high spatial resolution, this product allows mapping for metal contamination in the wafer. It realizes user-friendly structure through automation. It minimizes the maintenance and management cost by using a small amount of chemicals. With its short analysis time and mapping capacity, this product contributes to the improvement of productivity and yield through prompt response and prior detection to problems that occur in the process.
It is the equipment to provide the electron beam vertically to the evaporate surface using the electron beam gun, and it is used in the process of optical multi-layer films This is the process micro electro mechanical system (MEMS) known as the electron beam evaporation process Physical Vapor Deposition (PVD) The deposition process is used to open the data in the source and send those data to the basal board and also to form thin films or coating. Because this is inexpensive regarding the material cost and exhibits rather low process risk, PVD process is the chemical vapor deposition generally used for metal eposition. The process applying the deposition of thin films conducts modification with various kinds of surfaces wanted by the industry in order to provide data to the electronic industry for semicon doctor growth, reflection needing properties to the aerospace, environment to the permeability optics, surface protection from the board corrosion, and also thermal and chemical barrier coating.
Vacuum degassing chamber.
It is easy to use for the automation of analyzing processes. The overall efficiency of analysis increases with shortened time for analysis. The buffer zone keeps the process zone vacuum all the time, so the inflow of dirty gas from outside is minimized and the precision of analysis becomes maximized. Keeping the process zone vacuum delays the aging of heater components more than before, so it is good for cost reduction. The automation of analysis processes maximizes the utility of time of testing manpower. Minimizing the contact of samples for analysis to the outside minimizes contamination. The increase of analysis efficiency actualizes the dedtion of faultiness in advance, so it is possible to test the processes.
With is high spatial resolution, this product allows mapping for metal contamination in the wafer. It realizes user-friendly structure through automation. It minimizes the maintenance and management cost by using a small amount of chemicals. With its short analysis time and mapping capacity, this product contributes to the improvement of productivity and yield through prompt response and prior detection to problems that occur in the process.
