A Grading Rules : Panel Size (Thickness)13mm & 10.5mm ± 0.3 mm Panel Size (Lenght) 2480mm (Inv 2440mm) No Minus, max + 5 mm Panel Size (Widht) 1250mm (Inv 1220mm) ± 3 mm Pitch Widht 36mm - 45mm Pitch Minimum Length150mm Pitch Maximum Length500mm 2 Outer Edges Strips Finger Joint Strips Inside/Other Use Butt Joint Sound knot Allowed Dead knot Allowed Max 3mm Hole knot Not Allowed Putty Smear Allowed Clear and Smooth sanding Discolouration Allowed Blue Stain Allowed Smooth MC 10% ± 2% Wood Species Albasia (Albizia Falcataria)
Electro Automation Industries is Leading Stockist & Dealer of Motor Controller
Item: ABS Token Size: 25mm, 30mm,34mm, etc (can custom make) Thickness: 4.5mm Antenna: copper antenna Material: ABS Color: black or white(can custom make) Frequency: 13.56Mhz or 125Khz Chips Optional: TK4100, EM4200, FM1108, NXP S50,NXP Ultr/Ult-C, ICODE SLI/-X, Ntag213, etc; Read Distance: 1~5cm (depends on reader) Storage Temp.: -25~60 degrees Working Temp.: -25~60 degrees We offer a broad range of RFID Hard Tag, Electric Seal Tag for use in the demanding and harsh environments commonly found in the manufacturing, aerospace, automotive, maritime, oil, gas and chemical industries, as well as logistics and supply-chain applications. It includes ABS Token, Silicone Tag, E-seal tag, etc
We have combined 50 Years of Experience in Electrical Control Panels and Other Electrical items like Wires, Switch-gears,VFD, Bus Bars etc. We and our associate companies have manufactured and supplied Electrical Control Panels to many PSU's , Manufacturing Giants, Power Plants and many Process Plants. We not only manufacture Standard Equipment's but also have capability to design and Engineer the Electrical Panels as per the present and future demands.
It mainly tests the low temperature and high temperature limit of rubber and the aging time at different temperatures.
BLE Data Module could be widely used in all kinds of IOT devices, such as Smart Home Appliances, Wearable Devices, Smart Fitness Devices, Outdoor Electronics Equipments, etc. It is small size, low energy consumption and has strong anti-interference ability. By crossing connect the RX and TX of your MCU to the TX and RX of the BLE Module, you could communicate with APPs in smart phones through BLE Technology simply.
Functions and features *USB2.0 interface; * Support ARM7/9/11 (including thumb mode), Cortex-M0/M1/M3/M4 core *Support Serial Wire Debug (SWD); *Support Serial Wire Viewer (SWV); *Download speeds up to 720kb/s; *DCC mode up to 800 kb/s; * Seamless integration with IAR Workbench, Keill, ADS, RVDS; * No external power supply, power through USB; *Maximum JTAG speed is 12 MHZ; *Automatic kernel identification; *Automatic speed recognition; * Support adaptive clock; * Can monitor all JTAG signals and automatically adapt to the target board voltage; * Support multi-core debugging; * Completely plug and play; * Includes 20-pin standard JTAG connector; * Supports 1.2V-5V target board voltage; * Provide 5V 300mA for external power supply (control output by command); * 3.3V 300mA for external power supply (achieved by J3 jumper); *Includes USB and 20-pin flat cable; * Random distribution support software to observe and modify memory J-Mem; * Support embedded cache tracking Embedded Trace Buffer (ETB) * Optional online programming, programming FLASH software: J-Flash; *RDI plugin makes J-Link suitable for any RDI compatible debugger such as ADS, Relview, IAR, etc. * With RDI Flash DLL can be used to program and burn FLASH under RDI; * With GDB Server, you can debug in GDB environment. Support operating system: Microsoft Windows 2000 Microsoft Windows XP Microsoft Windows XP x64 Microsoft Windows 2003 Microsoft Windows 2003 x64 Microsoft Windows Vista Microsoft Windows Vista x64 Windows 7 Windows 7 x64 Windows 8 Electromagnetic compatibility (EMC) EN 55022, EN 55024 Operating temperature +5°C ... +60°C Storage temperature -20°C ... +65 °C Relative humidity (non-condensing) Max. 90% rH Mechanical Size (without cables) 100mm x 53mm x 27mm Weight (without cables) 70g
Features P/N: SP0210KT GE-Trusignal TS-G3 SpO2 adapter cable Latex free 2.2m TPU cable One year warranty CE/ISO 13485 FSC FDA Packages: non-sterilization, individual package with instruction Compatibility GE: GE-Trusignal Specification Safety: IEC 60601-1-1 approved, conformity with MDD 93/42/EEC and EN9919:2005 Ambient temperature: 0 to 40 (32 to 104) Relative humidity: 15% to 95% Measurement technology: Tri-wavelength LEDs & photo detector LED wavelength: 660nm/880nm/905nm SpO2 accuracy: ±3 (70-100%); Unspecified (0-69%) Pulse rate range: 20-250bpm Pulse rate accuracy: ±3 (20-250bpm)
NIBP pump/module M3000-60003 use for Philips MP20 MP30 MP40 MP50 MP60 MP70 MP80 MP90.
In the power electronic module technology, the DBC substrate is mainly used as a carrier for various chips (IGBT chip, Diode chip, resistor, SiC chip, etc.), and it is placed in an ultrasonic cleaning device for cleaning before soldering. It is necessary to use a cleaned basket to fix the DBC board and then put it into the equipment for cleaning.
DongHongXin 4 inch crystal plate is made of high quality imported sus420j2 stainless steel material. It has high hardness, high flex resistance, high flatness, high smoothness, smooth surface and no burr. It is in line with the mainstream film, cutting and drawing. The requirements of the chip device and the size requirements of the standard 4-inch wafer.
The wafer plate is mainly used to support the wafer on the fixed blue film. Because the blue film has very high requirements on the surface finish and flatness of the wafer plate, we use laser cutting to cut the raw material into pieces and then polish it. After grinding, heat treatment is performed to make the hardness HRc>47. This product will be more viscous and more resistant to folding.
The semiconductor package hanging basket is made of high quality 304 stainless steel. The surface is finely polished and beautiful. Smooth and burr-free. It is safer and safer to use. The etched buffer number can distinguish products in an orderly manner, and find products at a glance to improve production efficiency.
Donghongxin 8-inch wafers are processed with imported new pp materials. They are non-toxic and environmentally friendly. The color is even and vivid, and can be reused to ensure that the wafers are not polluted by the external environment. The 25-slot large storage + arc angle design not only avoids damage to the wafer, but also saves you money by storing more wafers.
After the wafer is cut, the shop operator can automatically lock the 8-inch automatic lock wafer storage rack, and the frame for fixing the wafer will be locked inside to avoid the wafer due to operator error. The problem of falling pieces occurs, ensuring the safety of the cut wafers, and also improving production efficiency.
The TPAK aluminum box is designed with a portable + baffle. The TPAK package is safer, more convenient and faster, and is a good product to improve the production efficiency of the package. Product Code: WBF40TP2-000-R0; Material: 6063 aluminum profile; Number of slots: 5 slots; Dimensions: 135*183*101 mm; Surface treatment: surface sandblasting oxidation treatment; Accessories: cartridge *1 + baffle * 2 Packing: Carton packaging.
Sop package cleaning basket is good, but many enterprises often use the sop package cleaning basket slot size delivered by the supplier during the use process. The size of the slot is not accurate, and it is easy to appear that the problem of poor material placement during the ultrasonic cleaning process causes product defects, and some may hit the ultrasonic cleaning machine, which seriously affects the service life of the equipment. Therefore, in the selection of sop package cleaning basket must choose the quality of the supplier, in order to ensure the quality of the production line.
The ic frame ultrasonic cleaning basket is made of 304 stainless steel. After precise laser cutting, each slot is more precise to ensure that the ic frame will not be deformed during storage. The overall frame is welded by the master of welding technology experience for more than 10 years. The welding points are even and full, and the ic frame ultrasonic cleaning basket is more durable. After the welding is completed, the entire ic frame is ultrasonically cleaned to the surface of the basket for electrolytic treatment. The surface is smooth and smooth, and the ic frame is smoother. The quality of the ic frame is guaranteed from every detail, so that customers can favor your company more and give you a steady order.
QFN wafer ring is made of high quality imported corrosion-resistant stainless iron material, laser-cut, stamped material, and then polished surface treatment process. It can also be matt to solve the problem of poor UVtape adhesion when the blue film is attached. Donghongxin QFN iron ring has smoothness, high precision, smooth surface and no burr, and has the advantages of excellent folding resistance, excellent corrosion resistance and strong scratch resistance. Our regular sizes are: 6 inch, 8 inch, 12 inch, thickness 1.0/1.2/1.5mm, laser engraving and logo according to your requirements. Welcome new and old customers to come to consult and discuss cooperation.
Inside the box, the wafer chip is transported during the production process without the need to remove expensive wafers, bumps, scratches, and the like. DongHongXin non-standard wafer frame raw materials made of Japanese imported materials to make durable, flatness, high hardness, anti-folding, anti-corrosion performance, anti-scratch ability and so on
