CuCo1Ni1Be/CW103C Cobalt Nickel Beryllium Copper Chemical Composition: Be: 0.40-0.70% Co: 0.80-1.30% Ni: 0.80-1.30% Cu: Balance Note: Copper plus additions equal 99.5% minimum. Shapes : Round bars, Round wires, Round tube, Flat bars, Square bars, Rectangular bars, Hexagon bars, Plates, Sheets, Coils Custom shapes are available upon request. Available Sizes: Rod: Dia.5~16mm; Wire: Dia.0.1-5.0mm Tube: OD10~60mm, ThK 0.1~10mm Plate: thk min 0.5mm Custom Diameter & Sizes, Random Mill lengths Typical Physical Properties: Density (g/cm3): 8.83 Density before age hardening (g/cm3): 8.75 Elastic Modulus (kg/mm2 (103)): 14.10 Thermal Expansion Coefficient (20 °C to 200 °C m/m/°C): 17 x 10-6 Thermal Conductivity: 209 W/m � oK at 20 C Melting Range (°C): 1000-1070 Note: 1). the units are based upon Metric. 2). the typical physical properties apply to age hardened products. Related Standard : Rods/Bars/Tubes: ASTM B441, SAE J461,463; RWMA Class 3 Sheets: ASTM B534 Wires: ASTM B441 Plates: ASTM B534, SAE J461,463; RWMA Class 3 European Standards: CuCo1Ni1Be, CW103C to EN Other material are also available C17200/CuBe2/CW101C/DIN 2.1247 C17300/CuBe2Pb/CW102C/DIN 2.1248 C17500/CuCo2Be/CW104C/DIN 2.1285 C17510/CuNi2Be/CW110C/DIN 2.0850 CuCo1Ni1Be/CW103C
Copper-powder fractions 69.1% cu63 & 30.9% of cu65 with purity 99.99%.
C18150 Chromium Zirconium Copper bar as per RWMA Class 2
Ed copper foils for fpc Dimension range: Thickness: 9~35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film. Features: High density, high bending resistance and good etching performance. S-hte ed copper foils for pcb Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb)
Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb)
S-hte ed copper foils for pcb Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb) One-side shiny
Vlp ed copper foil Specifications: Thickness: 1/4oz~3oz(9µm~105µm) Max size: 1295mm×1295mm Performance: ClassificationUnit9µm12µm18µm35µm70µm105µm Cu content%=99.8 Area weigthG/m280±3107±3153±5283±7585±10875±15 Tensile strengthR.T.(23?)Kg/mm2=28 H.T.(180?)=15=18=20 ElongationR.T.(23?)%=5.0=6.0=10 H.T.(180?)=6.0=8.0 RoughnessShiny(ra)µm=0.43 Matte(rz)=3.5 Peel strengthR.T.(23?)Kg/cm=0.77=0.8=0.9=1.0=1.5=2.0 Degraded rate of hcl(18%-1hr/25?)%=7.0 Change of color(e-1.0hr/200?)%Good Solder floating 290?Sec.=20 Appearance(spot and copper powder)----None PinholeEaZero Size toleranceWidthMm0~2mm LengthMm---- CoreMm/inchInside diameter 79mm/3 inch
High-precision rolled copper foil Rolled copper foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material. Base material: c11000 copper, cu > 99.96% Thickness range: 0.009mm-0.15mm Width range: 200mm-640mm Temper: hard, soft Application: ccl, electronics shielding and heat radiation, wide copper tape etc. NameGbAlloy no.Size (mm) (iso)(asmt)(jis)(bis)(din) Copper foilT2Cu-etpC11000C1100C101R-cu57Thickness: 0.009-0.15 /max width: 640 ItemUnitThickness 9um12um18um35um70um90um PurityCu%=99.97 Surface roughnessRaUm=0.17 Tensile strengthRm(hard)N/mm2420-440450-470460-480430-450410-430 Rm(soft)N/mm2160-180180-220200-230210-240220-250 ElongationA50(hard)%0.8-1.20.8-1.31.0-1.51.2-1.81.5-2.0 A50(soft)%=5.0=6.0=8.0=10.0=15.0=20.0 Oxidation resistance200?Min60 PinholeEaNone WidthMm100-660 Width accuracyMm0~ +2 Core/3 in, 6 in, 80mm Note: we can provide products with other properties according to customers` requirements. Physical properties Density: 8.9g/cm3 Electrical conductivity (20°c): min 90%iacs for annealed to temper Min 80%iacs for rolled to temper Thermal conductivity (20°c): 390w/(m°c) Elastic modulus: 118000n/m Softening temperature: =380°c Sizes and tolerances (mm) ThicknessThickness tolerancesWidthWidth tolerances 0.012~0.04± 0.001100~600± 0.1 > 0.04~0.10± 0.002 Specifications available (mm) ThicknessWidthTemper 0.012~0.04100~600O, h, > 0.04~0.10100~600O, h
Ed copper foils for fpc Dimension range: Thickness: 9~35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film. Features: High density, high bending resistance and good etching performance.
High-precision rolled copper foil Rolled copper foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material. Base material: c11000 copper, cu > 99.96% Thickness range: 0.009mm-0.15mm Width range: 200mm-640mm Temper: hard, soft Application: ccl, electronics shielding and heat radiation, wide copper tape etc. Note: we can provide products with other properties according to customers` requirements. Physical properties Density: 8.9g/cm3 Electrical conductivity (20°c): min 90%iacs for annealed to temper Min 80%iacs for rolled to temper Thermal conductivity (20°c): 390w/(m°c) Elastic modulus: 118000n/m Softening temperature: =380°c
Ed copper foils for fpc Dimension range: Thickness: 9~35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film. Features: High density, high bending resistance and good etching performance. S-hte ed copper foils for pcb Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb) Vlp ed copper foil Specifications: Thickness: 1/4oz~3oz(9µm~105µm) Max size: 1295mm×1295mm
1. Material: tinned copper foil 2. Single foil thickness: 0.05mm, 0.10mm, 0.20mm, ... 3. Cross section: 50-4000 SQMM 4. Purpose: flexible electrical or conductive connection 5. RoHS compliant 6. Customization available for special dimension, shapes and structure.
Cas no: 7440-33-7Eninec no: 231-143-9 Mf: w Grade standard:industrial, Purity:99.9%Appearance: black poweder Application:hard alloySize:40nm, 70nm, 100nm, 150nmShape:spherical Note: we can supply different size products of nano tungsten w nanoparticles according to client's requirements. Product performance Nano powder particles is uniform, high activity, high specific surface passivization treatment after the powder can be controlled in oxygen content of less than 1%.
Negotiation must be done first then test and buy the product, we also proposed penalty cost after negotiation being done All products are by tons
1. copper cathode 2. copper wire scrap 3. sunflower oil 4. soybeans seeds 5. used rails 6. palm oil 7. urea 46% nitrogen granular 8. white corn 9. sisal fiber 10. cashew nuts 11. sesame seed 12. hardwood charcoal 13. a4 paper 14. icumsa 45 sugar 15. wood pellets 16. paper scrap 17. used engines 18. yamaha cardboard engines 19. pet bottle scrap 20. almond nuts 21. pistachio nuts 22. battery scrap 23. computer scrap 24. phone scrap 25. beef meat 26. goat meat 27. lamb meat 28. wet salted cow 29. cocoa 30. Arabica Coffee 31. Ubc Aluminum Scrap.
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Copper concentrate 20-30% Copper Millbery - 99.97% CIF or FOB
Copper Rolls
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