Electronic ballast.
Product: Solder Ball Product composition: tin 99.3 copper 0.7 Product size: 13mm 19mm 22mm customizable Product weight: can be customized Solder ball is an indispensable and important material in new packaging. It is a new connection method that meets the requirements of electrical interconnection and mechanical interconnection. Due to the rapid development of BGA and CSP in recent years, it has replaced the traditional pin package and lead frame package, thus playing an important role in electrical interconnection and mechanical support in solder balls. BGA, CSP and other packaged devices connected by solder balls are widely used in notebook computers, mobile phones, PDAs, DSCs, LCDs and 3C products. This provides a broad application market and development prospects for solder ball products.
