Ed copper foils for fpc Dimension range: Thickness: 9~35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film. Features: High density, high bending resistance and good etching performance. S-hte ed copper foils for pcb Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb)
Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb)
S-hte ed copper foils for pcb Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb) One-side shiny
Vlp ed copper foil Specifications: Thickness: 1/4oz~3oz(9µm~105µm) Max size: 1295mm×1295mm Performance: ClassificationUnit9µm12µm18µm35µm70µm105µm Cu content%=99.8 Area weigthG/m280±3107±3153±5283±7585±10875±15 Tensile strengthR.T.(23?)Kg/mm2=28 H.T.(180?)=15=18=20 ElongationR.T.(23?)%=5.0=6.0=10 H.T.(180?)=6.0=8.0 RoughnessShiny(ra)µm=0.43 Matte(rz)=3.5 Peel strengthR.T.(23?)Kg/cm=0.77=0.8=0.9=1.0=1.5=2.0 Degraded rate of hcl(18%-1hr/25?)%=7.0 Change of color(e-1.0hr/200?)%Good Solder floating 290?Sec.=20 Appearance(spot and copper powder)----None PinholeEaZero Size toleranceWidthMm0~2mm LengthMm---- CoreMm/inchInside diameter 79mm/3 inch
High-precision rolled copper foil Rolled copper foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material. Base material: c11000 copper, cu > 99.96% Thickness range: 0.009mm-0.15mm Width range: 200mm-640mm Temper: hard, soft Application: ccl, electronics shielding and heat radiation, wide copper tape etc. NameGbAlloy no.Size (mm) (iso)(asmt)(jis)(bis)(din) Copper foilT2Cu-etpC11000C1100C101R-cu57Thickness: 0.009-0.15 /max width: 640 ItemUnitThickness 9um12um18um35um70um90um PurityCu%=99.97 Surface roughnessRaUm=0.17 Tensile strengthRm(hard)N/mm2420-440450-470460-480430-450410-430 Rm(soft)N/mm2160-180180-220200-230210-240220-250 ElongationA50(hard)%0.8-1.20.8-1.31.0-1.51.2-1.81.5-2.0 A50(soft)%=5.0=6.0=8.0=10.0=15.0=20.0 Oxidation resistance200?Min60 PinholeEaNone WidthMm100-660 Width accuracyMm0~ +2 Core/3 in, 6 in, 80mm Note: we can provide products with other properties according to customers` requirements. Physical properties Density: 8.9g/cm3 Electrical conductivity (20°c): min 90%iacs for annealed to temper Min 80%iacs for rolled to temper Thermal conductivity (20°c): 390w/(m°c) Elastic modulus: 118000n/m Softening temperature: =380°c Sizes and tolerances (mm) ThicknessThickness tolerancesWidthWidth tolerances 0.012~0.04± 0.001100~600± 0.1 > 0.04~0.10± 0.002 Specifications available (mm) ThicknessWidthTemper 0.012~0.04100~600O, h, > 0.04~0.10100~600O, h
Ed copper foils for fpc Dimension range: Thickness: 9~35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film. Features: High density, high bending resistance and good etching performance.
High-precision rolled copper foil Rolled copper foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material. Base material: c11000 copper, cu > 99.96% Thickness range: 0.009mm-0.15mm Width range: 200mm-640mm Temper: hard, soft Application: ccl, electronics shielding and heat radiation, wide copper tape etc. Note: we can provide products with other properties according to customers` requirements. Physical properties Density: 8.9g/cm3 Electrical conductivity (20°c): min 90%iacs for annealed to temper Min 80%iacs for rolled to temper Thermal conductivity (20°c): 390w/(m°c) Elastic modulus: 118000n/m Softening temperature: =380°c
Ed copper foils for fpc Dimension range: Thickness: 9~35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film. Features: High density, high bending resistance and good etching performance. S-hte ed copper foils for pcb Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb) Vlp ed copper foil Specifications: Thickness: 1/4oz~3oz(9µm~105µm) Max size: 1295mm×1295mm
1. Material: tinned copper foil 2. Single foil thickness: 0.05mm, 0.10mm, 0.20mm, ... 3. Cross section: 50-4000 SQMM 4. Purpose: flexible electrical or conductive connection 5. RoHS compliant 6. Customization available for special dimension, shapes and structure.
Cas no: 7440-33-7Eninec no: 231-143-9 Mf: w Grade standard:industrial, Purity:99.9%Appearance: black poweder Application:hard alloySize:40nm, 70nm, 100nm, 150nmShape:spherical Note: we can supply different size products of nano tungsten w nanoparticles according to client's requirements. Product performance Nano powder particles is uniform, high activity, high specific surface passivization treatment after the powder can be controlled in oxygen content of less than 1%.
Min. Order / Reference FOB Price 500 Pieces : US $0.5/ Piece Port : Ningbo, China Production Capacity : 500000000000PCS Payment Terms : L/C, T/T, D/P Connection : Male Shape : Equal Head Code : Round Angle : 90 Degree Wall Thickness : STD Material : Copper
Min. Order / Reference FOB Price 500 Pieces : US $0.5/ Piece Port : Ningbo, China Production Capacity : 500000000000PCS Payment Terms : L/C, T/T, D/P Material : Copper Connection : Welding Transport Package : Seaworhty Specification : Customized Trademark : MAXCOOL Origin : China
1. Molecular formula: cuo 2. Cas no.: 1317-38-0 3. Application: agricultural fungicides; Used for fireworks, firecracker, surface heat absorption agents for solar enargy; Used for glass, ceramic, enamel, rayon, ferrite magnetic materials; Electronic circuit board plating; Artificial rainfall, catalysts.
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