Layer: 1 to 16 layers Material type: FR-4,CEM-3,High TG,FR4 Halogen Free,RIGID-FLEX Board thickness: 0.20mm to 3.4mm copper thickness: 0.5 OZ to 6 OZ copper thickness in hole: >25.0 um(>1mil) Max size of finish board: 700*460mm Min.Drilled Hole Size: 1.0mm Min.Line Width: 3mil Min.Line Spacing: 3mil Surface finishing: HASL/HASL lead free,HAL,Chemical tin,Chemical Gold, Immersion Silver/Gold,OSP,Gold plating Solder Mask Color: Green/Yellow/Black/White/Red/Blue Shape tolerance: ±4mil Hole tolerance: PTH:±3mil,NPTH:±2mil Package: Inner paking/Plastic bag,Outer packing:Standard carton packing Certificate: UL,SGS, ISO 9001:2008,IATF16949 Special requirements: Buried and blind vias+controlled impedance+BGA Profiling: Punching,Routing, V-CUT,Beveling
