Advantage of Sawing Wire for Solar Wafer Cutiing -------- Very thin and tensile wires of low keff loss Hence more wafters per cut and less fractures Make higher productivity Tight diameter and ovality tolerances A wide range of spool types An advanced winding technology Hengxing Solar Wafer Cutting Diamond Multi-Wire Sawing Ultra Fine Steel Saw Wire Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon. It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc. (1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw. (2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity. (3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well. (4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few. ( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources. Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
