Layers:1-50 layers Material:FR4 standard Tg 130C, FR4 medium Tg 150C, FR4 high Tg 170C Board Thickness:.0079"-.126"(0.2mm-8.0mm) Copper Thickness:0.5oz-12oz(18um-210um) Inner layer Copper Thickness:0.5oz-6oz(18um-70um) Board size:1200x700mm Min Tracing/Spacing:3.0mil/3.0mil Min Annular Ring:3mil Min drilling Hole diameter:0.2mm(8mil), 0.1mm(4mil)-laser drill Solder Mask:Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue Silkscreen color: White, Blue, Black, Red, Yellow,no Surface finish: HASL -Hot Air Solder Leveling Lead Free HASL - RoHS ENIG -Electroless Nickle/Immersion Gold - RoHS(Thick of Au 1-4 u") Immersion Silver - RoHS Immersion Tin - RoHS OSP -Organic Solderability Preservatives - RoHS Surface/Hole plating thickness:20-30um Board thickness tolerance:0.1mm ~ 10% Board size tolerance:0.1mm~0.3mm PTH hole size tolerance:.003"(0.08mm)~.006"(0.15mm) NPTH hole size tolerance:.002"(0.05mm) Copper thickness tolerance:+0um+20um Impedance tolerance:5%~10% SMD Pitch:0.2mm(8mil) BGA Pitch:0.2mm(8mil) Aspect Ratio(hole size: board thickness):1:40 Chamfer of Gold Fingers:20, 30, 45, 60
