1.Introduction The new generation of laser scribing machine YMS-50 (CE certificated product) is capable of scribing various silicon wafer, solar cell, ceramic wafer, thin metal sheet (~0.5 mm thick maximum), etc., in industries of electronics, semiconductor and solar energy, etc.. It is designed by experts with professional features, such as excellent beam quality and power stability, precise CNC worktable and efficient auto cooling system. Some of the most important parts are manufactured in UK, USA and Germany. Thanks to the automatic control of the whole system, you can save more efforts on the manufacturing, instead of how to operate and maintain the system. 2. Features Excellent beam quality and system reliability High-speed scribing (up to 120 mm/s), very low-defective index Auto cooling system Precise CNC worktable Friendly man-machine interface and simple software operation 3. Technical Parameters Laser medium Nd3+:YAG Wavelength 1064 nm Pump source Kr lamp Laser cavity Ceramic Modulated frequency 0.5 - 50 kHz Beam power Adjustable, max 50 W Aiming laser Red Scribing speed Adjustable, max 120 mm/ s Scribing depth Max 1.2mm Line width Min 0.2mm Worktable repeating accuracy 0.01mm Marking area 300 mm í- 300 mm Power supply 3-phase 4-wire AC 380V í+ 10%,50 Hz /60 Hz,PE,(A voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation) Input power Max 5kW Dimension 550 mm x 290 mm x 650 mm Net weight ~560 kg Cooling Mode Water cooling 4.Standard Configuration Laser machine í- 1 set Exhauster í- 1 set Vacuum pump í- 1 set Cooling unit (Chiller, temperature controller, water tank, filter) í- 1 set Worktable unit (CNC controller) í- 1 set Kr lamp í- 2 pieces Laser detector í- 1 piece PC í- 1 set Scribing software (In English) í- 1 set Operation manual (In English) í- 1 Wooden Case
