Application: back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN wafers, silicon-based chips, etc Grinding Machines: NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc Bonded: Vitrified bond & Resin bond Diameter (mm): 200mm, 250mm, 280mm, 300mm, 350mm
