Ceramics Substrate

We can supply you with many kinds of ceramic substrate, and they are widely used in electrical area, such as large scale integrated circuit, semiconductor package and so on. And material is 95%, 96%, 99%, 99.5% alumina, zirconia and zta. Features: Properties with excellent insulation, high mechanical strength, high thermal conductivity, low expansion coefficient, small dielectric constant, high-temperature resistance, excellent erosion and wear resistance, good quality in chemical shock heat and cold. 1. Size: on the request 2. All kinds of customized ceramic substrate are available in customized requirement.

this section of the ceramic substrate design concept is to allow high power, small size, high brightness LED use development designed to replace a section merit system board, directly to multiple LED chip package on top, and then by the second optical lens more compact size makes the product volume and let your light LED products reduce the area, reducing materials, system cost, the human cost of replacing the assembly, so that you package more quickly, Wire bonding the chip directly on the substrate, with the use of ceramic heat with excellent results, but also allow your LED brighter and longer life. This product suitable for high power LED's package, such as: LED lights

ceramic circuit board with Led heat dissipation and long service life Folysky Technology (Wuhan) Co.,Ltd.is a professional high-tech enterprise engaging in planar and curved non-metallic base planel, electronic circuit board and electronic components which integrates research and development, production and sales. It has a unique technical advantage in the direct graphics of PCB by developing the powerful wuhan photoelectric national laboratory. The company's main product is ceramiccircuit board, such as alumina ceramic circuit board,aluminum nitride ceramiccircuit board, zirconia ceramic circuit board, glass circuit board,LEDceramic circuit board (including 2D and 3D circuit board),  with self-developed technology of Laser rapid Activation Metallization (Laser Activation Metallization, LAM technology for short). High bonding strength and good electrical performance between metal and ceramic can be repeated welding. Metal layer thickness is adjustable in 1 mu m - 1 mm. L/S resolution can reach 10m, which can realize sealing plating directly, form double-sided substrate, and provide customized, high density PCB solutions for customers. At present, the conventional LED lighting system on the market has the quality problems caused by poor heat dissipation and short life of the driving power. The inconvenience of maintenance and repair also limits the LED lamp's comprehensive replacement of traditional lamps to a certain extent. The ceramic circuit board produced by our company has a strong heat dissipation capacity, and the installation of ceramic circuit board on the LED lamp is long life! You are totally worth it.. 3535 technical parameters of ceramic circuit board: Base material type: alumina ceramics Substrate material thickness: 0.5mm Conductive layer: Copper Thickness of metal layer: 35 mu m/35 mu m Surface treatment: heavy silver One side / double side of metal: double side Copper plated through holes: Yes Resistance welding: Yes

The photosensitive sensor is currently the highest yield, the most widely used sensor, exist in the form of photosensitive resistance, along with the change of light intensity, the resistance value is also relatively change, resulting with the light intensity of the pulse signal. The structural elements of common cadmium sulphide photosensitive electrode are: electrode / cadmium sulfide / ceramic substrate / wire / resin moisture-proof film, etc.. Ceramic substrates have been widely used in photosensitive resistors. Product features: The ceramic circuit board has high accuracy and good electrical and thermal properties 2. Ceramic circuit board with high bonding strength and good weldability, can realize blind through hole 3. Ceramic circuit board technology is mature, environmental protection, pollution-free, cost is lower than traditional technology 4., a wide range of applications, single-sided and double-sided three-dimensional ceramic circuit boards can be produced 5. Customized production, without mold opening, short production cycle 6., no organic ingredients, resistant to cosmic radiation, high reliability in aviation and space, long service life. 7. Can carry out high-density assembly, line / pitch (l/s) resolution can reach 20 m, so as to realize the integration and miniaturization of equipment. 8. High frequency loss, it can be used in high frequency circuit. 9. Copper sealing, high reliability. 10. 3d substrate and 3d routing. 1. Ceramic circuit board appearance size is not limited 2., ceramic laser printing, three-dimensional routing 3. Ceramic circuit board without mask, fast response 4. Ceramic circuit board technology is mature, environmental protection, pollution-free

TO-220 High precision alumina ceramic polishing pads Place of Origin: Guangdong, China (Mainland) Type: Ceramic Plates Application: Industrial Ceramic Material: Alumina Ceramic Model Number: Customer's Requirements Brand Name: laimeisi Color: White Thermal conductivity: 20w/m.k Feature: High Temperature Resistance Shape: Square Name: Alumina Ceramic Parts Size: Customised Density: 3.6g/cm3 Product name: Al2O3 Ceramic Custom Certificate: SGS Usage: Dispersing Packaging Details: As customer request Delivery Detail: 3-7 days after payment Materialï¼?alumina,ceramics Alumina content: >=95% Feature:insulated,heat resistance,power cooling Application: Alumina Ceramic sheet plays a very important role in Chinese technical ceramics industry. we focus on providing a better solution for our customers to reduce purchasing cost.

A960 Alumina offers consistently reliable and convincing performance even when subject to high thermal and electrical loads in terms of its: Thermocycling capability, Thermal shock resistance, Flexural strength, Surface quality, Thermal conductivity. This makes A960 Alumina Ceramic Substrates ideal for power electronics in conjunction with direct copper bonding (DCB) and active metal brazing (AMB). ALN Aluminum Nitride - with outstanding insulating properties and extremely high thermal conductivity (â?¥ 170 W/mK), Aluminum Nitride is perfect for the extremely high performance required in the electronics industry. AlN ceramic enables the compact, affordable construction of components and hybrid designs with high integration density. Extraordinary mechanical strength and a low thermal expansion coefficient enable seamless system integration.

BeO ceramic materials.BeO has high thermal conductivity, high melting point (2530 ± 10°C), high strength, high insulation, high chemical and thermal stability, low dielectric constant, low dielectric loss and good adaptability properties,etc.Widely used in special metallurgy,vacuum electronics,nuclear technology,microelectronics and optoelectronics. Especially in high-power semiconductor devices,integrated circuits, package microwave vacuum devices and nuclear reactors. Beryllium oxide (BeO), also known as beryllia, is an amorphous solid. Its high melting point leads to its use as a refractory material. Sintered beryllium oxide is a very stable ceramic. BeO-ceramic has a high range of thermal conductivity between 300 500 W/(m.k), the highest among all ceramic materials used in electronic technology. It is used in many high-performance semiconductor parts for applications such as radio equipment ,a filler in some thermal interface materials such as thermal grease, a structural ceramic for high-performance microwave devices, vacuum tubes, magnetrons, and gas lasers,etc... Features 1. High thermal conductivity 2. High melting point 3. Excellent insulation 4. Low dielectric constant 5. Coating Layer: Molybdenum-Manganese(Mo/Mn) T: 8~30m Plated Layer: Nickel(Ni), Copper(Cu), Gold(Au), Etc. T: 2~9m 6. Excellent thermal shock resistance

strate name:custom design service for ceramic metallized substrates Substrate material thickness:0.635mm Conducting layer:Cu, Ni, Au Thickness of metal layer:300�¼m Surface preparation:immersion gold Metal single-sided / double sided:single sided Copper plated through hole:no Solder mask:no

Compared to the common PCB, Sliton ceramic substrate is more thermal & voltage resistant, which can be applied in the field of smart lighting, smart chips, electronic materials, aerospace, LED, sensors, etc. This new material, using laser speedy activation and metallization technology, has the advantages of printing speediness, delivery speediness, size selection, specification and customization over the others.