Flex Pcb/fpc1

Product Parameter Materials: Polyimide Board Thickness:0.13mm Layer:2 Surface finished: immersion gold Features: Stiffener: PI

General specification for flexible & rigid-flex printed circuit board Layer count: 1-6l(flex) & 2-10l(rigid-flex) Board thickness: 0.05-3.0mm Base polyimide film thickness: 0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ). Copper thickness: 1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ) Stiffeners: polyimide, fr4, metal Min trace width/spacing: 3/3mil(0.075/0.075mm) Min drill size: 0.2mm Surface treatment: immersion gold/tin, gold/tin plating, osp Vacuum package

Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test

Rigid-Flex circuit boards are composed of a combination of rigid and flexible circuit boards that are permanently connected to one another. The proper application of Rigid-Flex circuit boards offers optimum solutions for difficult, limited space conditions. This technology offers the possibility of a secure connection of device components with the assurance of polarity and contact stability, as well as a reduction in plug and connector components. Additional advantages of pcb bare board are dynamic and mechanical stability, the resulting 3-dimensional freedom of design, simplified installation, space savings, and maintenance of uniform electrical characteristics. Use of Rigid-Flex circuit boards can reduce the total cost of the final product. Rigid-Flex circuit boards give you unlimited freedom of packaging geometry while retaining the precision density and repeatability of printed circuits. As a high reliability replacement for wire and wire harness assemblies, flex circuits provide a significant cost savings with no reduction in performance.

Layers : Sample 1~32 / Mass Production 1~20 Size :Max shipping size is 600mmx550mm , +/-0.15mm Finished Board Thickness: Min 0.4mm(4L)/0.6mm(6L),+/-0.1mm (Max) 3.6mm(2.2~3.6mm depends on material), +/-10% Copper Thickness :1/3~5oz (Depends on material) Impedance Control :+/-10% Via Holes (Min) : Mechanical Drill:0.2mm / Micro Via:0.1mm PTH+/-0.075mm NPTH +/-0.05mm Aspect Ratio : Sample :10:1 / Mass Production :8:1 Min Trace(Width/Spacing) : Internal 0.075mm / External 0.075mm The tolerance followed by IPC-6012 Advance Process : Blind Routing Cavity,Coil Board,Plug Hole With Epoxy,Half Hole Plated Spacing between Pads : Min :8 mil

Product Parameter Materials: FR4+Polyimde Overall Board Thickness:1.75mm Layer:4 Surface finished: ENIG Features: Min hole: 0.20mm Hybrid board 4layers flex+4layers rigid pcb

Multilayer pcbs Major material: fr-4, nelco, htg>170, high cti value, halogen free Minimum board thickness: Double sided: 0.2mm Multilayer: 0.4mm Maximum board thickness: Double sided: 2.4mm Multilayer: 3.2mm Surface finishing: Hal Lead-free hal Flash gold Selective gold Immersion gold (enig) Immersion tin Immersion silver Carbon print Gold fingers Entek (osp) Flux coating Peelable mask Gold plating (hard gold) Enig thick gold Solder mask plugged hole Copper finished thickness: 1/2 oz to 6 oz Minimum hole size: 0.25mm Minimum line width/spacing: 0.1 Standard: rohs, sgs, ukas, iso14001, dnv, ul We have: Advanced equipment Reliable quality Reasonable price High output Quick delivery Unlimited ordering quantity Packing: vacuum packing

NAME: 6 LAYERS RIGID-FLEXIBLE PCB Board thickness: 0.6MM Copper thickness: 0.5OZ Minimum line width/space: 3/3 mil Minimum drilled hole diameter: 0.10MM Surface finish: ENIG Special process: mix lamination , laser drilling

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