High Quality Thin 0.5Mm Pcb 2 Layer With Tg 150

INDIUM PHOSPHIDE (InP) WAFERS are semiconductor materials made of indium phosphide, a compound semiconductor that is widely used in high-frequency and optoelectronic applications. Due to its efficient electron mobility and direct bandgap properties, InP is favored for devices such as:

High-speed electronics
Laser diodes
Photodetectors
Telecommunications applications, including optical fiber communication
We offer the following InP Wafers:
Undoped InP Wafers: These are pure InP with no intentional doping, used in various applications where intrinsic properties are required.
N-type InP Wafers: Doped with donor impurities (such as tellurium) to increase electron concentration, useful in transistors and high-speed electronics.
P-type InP Wafers: Doped with acceptor impurities (such as zinc) to create holes in the semiconductor, used in light-emitting devices and other optoelectronics.
InP Substrates: Used as a base for growing other semiconductor materials in heterostructures for various applications.
InP Membrane Wafers: Thin layers of InP used for specific applications, including applications in flexible electronics and advanced photonic devices.
InP-based Quantum Dot Wafers: Engineered to create quantum dots that can be used in photonic and optoelectronic devices for enhanced performance.

High-TG PCB High Temperature PCB fr4 Material
The Glass Transition Temperature (Tg) is one of the most important properties of any epoxy and is the temperature region where the polymer transitions from a hard, glassy material to a soft, rubbery material.
Circuit board material must flame-resistant, it canâ??t be burned at a certain temperature and only be soften. The temperature point is called the glass transition temperature (Tg).
The higher Tg point means higher temperature requirement during lamination. And the Aluminum clad Circuit Boards will be hard and crisp, which will affect hole and the electrical properties.
Ordinary PCB materials at high temperatures, not only will be soften, deformation, melting and other phenomena, but also the mechanical and electrical properties decline sharply.
General fr4 Tg is 130-140 centigrade, moderate Tg is greater than 150-160 centigrade, High-Tg is greater than 170 degrees.
The higher of Tg, the better performance of PCB heat resistance, moisture resistance, chemical resistance, stability and other characteristics.
FR4 is a code name for grade of Epoxy Glass material.
Tg means Glass Transition Temperature.
When the working temperature reaches to the melting point, that means the temperature exceeds the Tg value, the status of pcb material will be changed from glassy to liquid, which will affect the function of pcb. And this value is related to the stability of the pcb dimension.
As usual, made with Tg â?¥ 170â?? pcb material, which is called high Tg printed circuit board. With the rapid development of the electronics industry, high Tg material is widely used in computer, communication equipment, precise apparatus and instrument and etc.

High tg pcb

Base material: fr4, fr1, fr2, ceramics, aluminum, rogers, f4b, f4bk, f4bt, tp, pf, cem-1, cem-3, etc.
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: lpi solder mask, conventional solder mask, peelable solder mask, uv solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm (10mil)
Pth hole diameter tolerance: +/-0.076mm (+/-3mil)
Npth hole diameter tolerance: +/-0.03mm (+/-1.2mil)
Maximum board size: 460 x 620mm (18 x 24)
Board finishing type: hot air leveling, soft gold, hard gold, immersion gold, gold fingers

Tg 170, packing :vacuum packing in carton

Double side high TG PCB assembly 0201 components
PCBA Supplier, pcba processing manufacturer
4 YAMAHA High-speed SMT Lines
6 million daily SMT placements capability
400,000 daily DIP placements capability
500Ã?600 mm Maximum Board Size
0.25"x 0.25" Minimum Board Size
450 mm Max. Width for Wave-Solder
Passives Components Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement
SMT and DIP/X-RAY Inspection/AOI Testing/In-circuit-test (ICT)/Flying Probe/Function Test/Burn-in/Finished products assembly

Board thickness: 0.2mm-6.0mm
Laminate: fr-4, taconic, rogers, tg170, tg180, cem-1
Layers: single side, double side, multilayer
Outer / inner coppers: 1/1 oz, 1/2 oz, 2/2 oz, 2 oz, 3 oz, 4 oz.
Multilayer stack up: stack up, controlled impedence.
Pcb size: unit size, panel size, tooling strips, tooling holes and fudicials.
Min hole size: 0.2mm
(shape tolerance¡à 0.13mm, hole tolerance: pth¡à 0.075mm; npth: ¡à 0.05mm)
Min line width: 0.1mm
Min line spacing: 0.1mm
Solder mask color: green, blue, red, black, yellow, white
Legend color: white, yellow, black, blue, red
Surface finished: hal(tin / lead), hal(lead free), immersion gold, immersion silver,
Immersion tin, gold plated(soft gold), osp(entek).
Certificate: rohs, sgs, ukas, iso14001, dnv, ul
Profiling: cnc, routing, punching, beveling, v-cut, v-score, counter sink.
Test: e-test, fixture, fly-test.
Special technique: buried and blind vias, controlled impedance, bga.

We have:
Advanced equipment
Reliable quality
Reasonable price
High output
Quick delivery
Unlimited ordering quantity


Package: vacuum package

Number of Layers:
1-64-Layer
Base Material:
FR4,High-TG ,Rogers,Nelco,RCC,PTFE
Copper Thickness:
0.3-12oz
Board Thickness:
0.6-10mm
Min. Hole Size:
0.03mm
Min. Line Width:
0.035
Min. Line Spacing:
0.035
Surface Finishing:
HASL, Immersion Gold/Tin/Silver ,OSP
Board Size:
5mm*5mm-610mm*1100mm

Minimum line width/space: 8mils
Surface finish: immersion gold
Board thickness: 1.60MM
Minimum drilled hole diameter: 12mils
Copper thickness: 1oz

Minimum line width/space: 6mils
Surface finish: immersion gold
Board thickness: 1.60MM
Minimum drilled hole diameter: 10mils
Copper thickness: 1oz

Pcb manufacturer in china with best quality and competitive price.
1-20 rigid printed circuit board
1-2 layer white/black aluminum led pcb
From quickturn prototype to mass production.
Please don't pay before you send the pcb file to us.
Please send the file to leappcb at 163.Com.
Skype: leappcb website: www leappcb.Com
We will send the quotation to you asap, thanks.
Leappcb sales department----lillian

Depend on the specific order