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94V0 Understanding Rohs 8 Layer Pcb Hdi Pcb

Supplier From China
Jun-07-17

Quick Details

Place of Origin: Liaoning, China (Mainland) Brand Name: GESP Model Number: 2 Layer Pcb Base Material: FR-4 Copper Thickness: 0.25 Oz -12 Oz Board Thickness: 1.6mm-3.2mm 0.2mm-4.5mm Min. Hole Size: 0.15mm Min. Line Width: 5mil Min. Line Spacing: 4 mil Surface Finishing: HASL/enig/OSP/immersion silver /gold finger Base Material:: FR-4,CEM-3, Roger,teflon , taconic,arlon , Metal/ceramic/aluminum base Copper Thickness:: 0.25 oz -12 oz Board Thickness:: 0.005 Certificate:: ISO/UL/RoHS/TS16949 Gold thickness:: 0.05UM V-cut Scoring:: YES Standards:: IPC Class 2, Class 3 Max. Panel Size:: 22 Impedance Control: yes Surface Finishing:: HASL Lead Free/OSP/Soft Gold/Hard Gold

Price and Minimum Quantity

Price: $0.2
MOQ: Not Specified

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Special futures
Thickness: 1.6mm
Application: projector or projecting apparatus
Minimum trace size: 0.1mm
Minimum drill: 0.15mm
With blind and buried holes
Layers: 1 to 28
Board finished thicknesses: 0.2 to 7.0mm
Materials: FR-4, CEM-3, high Tg, halogen-free FR4 and Rogers,F4B
Maximum finished board size: 580 x 900mm
Minimum hole size: 4mil (0.1mm)
Minimum trace width/space: 3.5/3.5mil
Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP
Copper thicknesses: 0.5 to 6oz
Solder mask colors: green, yellow, black, white, red and blue
Copper thickness in hole: >18um
Inner packaging: plastic bag (vacuum packing)
Outline tolerance: ¡À0.13mm
Hole size tolerance: (PTH) ¡À0.076 and (NPTH) ¡À0.05mm
With UL and TS16949:2002 marks
Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger
Profiling: punching, routing, V-cut and beveling
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High density interconnect (HDI) PCB, represent one of the fastest growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design is able to incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter.
By using HDI technology, designers now have the ability to place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allow designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays.
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The most common reason for using HDI technology is a significant increase in packaging density. The space that obtained by finer track structures is available for components. In addition, overall space requirements are reduced will result in smaller board sizes and fewer layers.
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Material: fr4
Setup: 3 + 4 + 3
Finishing thickness: 1.0 ¡¨¤0.1mm
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