Quick Details
Place of Origin: Liaoning, China (Mainland) Brand Name: GESP Model Number: 2 Layer Pcb Base Material: FR-4 Copper Thickness: 0.25 Oz -12 Oz Board Thickness: 1.6mm-3.2mm 0.2mm-4.5mm Min. Hole Size: 0.15mm Min. Line Width: 5mil Min. Line Spacing: 4 mil Surface Finishing: HASL/enig/OSP/immersion silver /gold finger Base Material:: FR-4,CEM-3, Roger,teflon , taconic,arlon , Metal/ceramic/aluminum base Copper Thickness:: 0.25 oz -12 oz Board Thickness:: 0.005 Certificate:: ISO/UL/RoHS/TS16949 Gold thickness:: 0.05UM V-cut Scoring:: YES Standards:: IPC Class 2, Class 3 Max. Panel Size:: 22 Impedance Control: yes Surface Finishing:: HASL Lead Free/OSP/Soft Gold/Hard Gold
we are leading manufacturer & exporter of standoff/spacers as per requirement or Drawing
We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
Hankook Smart Flex AH35 FEATURES AND BENEFITS All weather traction Enhanced controllability Fuel efficient drive Excellent durability The Hankook Smart Flex AH35 is a highway terrain all-season tire manufactured for commercial vehicles. The tyre model is made to be mounted on the vehicle's steering axle. Hankook Smart Flex AH35 - Key Features All-Weather Performance: The tire offers reliable traction in dry, wet, and winter conditions, thanks to its wide grooves and 3D sipes, which also prevent hydroplaning. Enhanced Control: The ribbed tread design ensures constant road contact, improving steering response and driving stability. Fuel Efficiency: The optimized 3D siping reduces rolling resistance, leading to lower fuel consumption and CO2 emissions. Durability: Reinforced carcass structure maintains the tire's shape under heavy loads, extending tread life and making it cost-efficient.
For the Mosquito killer Led Bulb Light, is a 900 lumen bulb that doubles as an insect killer. The light features a blue UV LED which attracts insects into a Mosquito Killer grid.And the Mosquito Killer grid uses only 1W of electricity, while the light itself uses a meager 9W – and both can be used independently.They are used at home and outdoor. A brush is provided to clean off insects once the bulb switched-off.Compare to other traditional mosquito killer, this bulb has no chemicals, no sprays and hence no fumes to our life. • 2nd generation 2-in-1 LED LIGHT Bulb Plus LED Mosquito Killer Bulb • Wattage: 10W • Blue UV light • Lumen: 900-1000lm • Color Temperature (CCT): 6500K • Input Voltage: AC 90-130V & 220v-240V • With CE and ROHS Operation: Step1: Switch it on,both lighting +killing are on. Step2: Switch on again,light off,only killing on. Step3: Switch on again,killing off,only light on. Step4: Switch off, both off.
Special futures Thickness: 1.6mm Application: projector or projecting apparatus Minimum trace size: 0.1mm Minimum drill: 0.15mm With blind and buried holes Layers: 1 to 28 Board finished thicknesses: 0.2 to 7.0mm Materials: FR-4, CEM-3, high Tg, halogen-free FR4 and Rogers,F4B Maximum finished board size: 580 x 900mm Minimum hole size: 4mil (0.1mm) Minimum trace width/space: 3.5/3.5mil Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP Copper thicknesses: 0.5 to 6oz Solder mask colors: green, yellow, black, white, red and blue Copper thickness in hole: >18um Inner packaging: plastic bag (vacuum packing) Outline tolerance: ¡À0.13mm Hole size tolerance: (PTH) ¡À0.076 and (NPTH) ¡À0.05mm With UL and TS16949:2002 marks Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger Profiling: punching, routing, V-cut and beveling OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided. Inner:vacuum packaging. Outer:carton.
What is HDI PCB High density interconnect (HDI) PCB, represent one of the fastest growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design is able to incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter. By using HDI technology, designers now have the ability to place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allow designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays. HDI PCB is regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices. Advantages of HDI PCB The most common reason for using HDI technology is a significant increase in packaging density. The space that obtained by finer track structures is available for components. In addition, overall space requirements are reduced will result in smaller board sizes and fewer layers. Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
General specification for hdi pcb Layer count: 4-20layers Type of stack up: 1+n+1, 2+n+2 Material available: fr4, high tg fr4, halogen free fr4 Board thickness: 0.4-3.2mm Finished copper thickness: 1/3oz ¡§c 3oz Min trace width/spacing: 3/3mil Min through hole: 0.2mm Min blind via: 0.1mm Surface treatment: immersion gold, enig + osp Vacuum package
Material: fr4 Setup: 3 + 4 + 3 Finishing thickness: 1.0 ¡¨¤0.1mm Minimum width/spacing: 0.10/0.10mm Minimum laser via: 0.1mm Surface finishing: enig + osp Specialty: blind and buried via Application field: communication
Multilayer and 2rd HDI PCB 35
