New trends of gantry cutting machine: portable or heavy-duty
When you choose a gantry cutting machine, which factor will you think about, will you choose a portable gantry cutting machine or a heavy-duty gantry cutting machine?
Generally speaking, traditional heavy-duty gantry cutting machine weighs about 2000kg, but only 250kg for some portable gantry cutting machine. That’s why a portable gantry cutting machine can be delivered with light truck while the heavy-duty gantry cutting machine has to call for a container or auto truck.
If your budget is limited, we suggest you to choose portable gantry cutting machine, instead of heavy-duty gantry cutting machine. Compare with heavy-duty gantry cutting machine, the portable gantry CNC cutting machine can save 70% of your cost.
New trends of gantry cutting machine: portable or heavy-duty When you choose a gantry cutting machine, which factor will you think about, will you choose a portable gantry cutting machine or a heavy-duty gantry cutting machine? Generally speaking, traditional heavy-duty gantry cutting machine weighs about 2000kg, but only 250kg for some portable gantry cutting machine. That’s why a portable gantry cutting machine can be delivered with light truck while the heavy-duty gantry cutting machine has to call for a container or auto truck. If your budget is limited, we suggest you to choose portable gantry cutting machine, instead of heavy-duty gantry cutting machine. Compare with heavy-duty gantry cutting machine, the portable gantry cnc cutting machine can save 70% of your cost.
Fiber laser cutting machines can be designed into table type, gantry type according to customer requires. Multiple function modes can be added on machine.
Features: 1. This equipment proves most effective when used together with stone slicing machine. 2. Technical data for long stone cutting: max. diameter of blade-1200mm; max. number of blades used-5pcs; max. cutting height-450mm. 3. Cast iron is adopted in main frame of the machine to make the machine more stable with less chance of vibration under the operating condition. 4. The machine operates automatically through the main control unit consisting of frequency converter, transformer, AC contactor and time relay, which can more effectively control vertical movement of oil cylinder, trolley operation and slab cutting efficiency. 5. Unlike traditional stone cutting, it dramatically increases the productivity and reduce labor cost and power consumption and it consumes less diamond segment per cubic meter of production compared to the traditional cutting machine. Technical Data: Dimension: 5500*2800*2700mm diameter of blade:1200mm number of blades:5pcs Workbench/Table size:2500*1800mm Working stroke:2500mm Max. vertical stroke:600mm Weight:10t Max. cutting depth:450mm Main motor power:22*3kw
At the beginning of 2016, the RateTech Fibertec II, a laser cutting machine is honored to be launched to the world market, which surely brings a revolution to the industry of laser machine. Compared with common laser cutting machine, RateTech Fibertec II economical laser machine performs well in cutting thin plates and think plates, which offered an expected laser cutting solution to customers, who want to make their works be finished fast and with the good performance as a laser cutting machine does. It is absolutely a good option of laser cutting machine for the industry that seeks for revolutions and solution of economical laser machine with good quality.
Also known as oxy-fuel cutting machine, the flame cutting machine is used to cut mild steel or low carbon steel, which can also be worked by plasma cutting machine. But there are some differences between flame cutting machine and plasma cutting machine. For the cutting quality, flame cutting machine has an excellent cutting effect form 15mm, while plasma cutting machine can produce excellent cutting effect till 25mm. For the operation cost, flame cutting machine need to rework, while plasma cutting machine can result in a lower cost than that of a flame cutting machine.
At the beginning of 2016, the RateTech Fibertec II, a laser cutting machine is honored to be launched to the world market, which surely brings a revolution to the industry of laser machine. Compared with common laser cutting machine, RateTech Fibertec II economical laser machine performs well in cutting thin plates and think plates, which offered an expected laser cutting solution to customers, who want to make their works be finished fast and with the good performance as a laser cutting machine does.
Also known as oxy-fuel cutting machine, the flame cutting machine is used to cut mild steel or low carbon steel, which can also be worked by plasma cutting machine. But there are some differences between flame cutting machine and plasma cutting machine. For the cutting quality, flame cutting machine has an excellent cutting effect form 15mm, while plasma cutting machine can produce excellent cutting effect till 25mm.
Compared with common laser cutting machine, RateTech Fibertec II economical laser machine performs well in cutting thin plates and think plates, which offered an expected laser cutting solution to customers, who want to make their works be finished fast and with the good performance as a laser cutting machine does. It is absolutely a good option of laser cutting machine for the industry that seeks for revolutions and solution of economical laser machine with good quality.
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.