Material: FR-4
Thickness:2.0 mm
Size:127mm*139.7mm
Min Trace Width/Spacing: 6/6mil
Min hole:0.6mm
Surface Finishing: HASL
Impedance Control
Supplier: Hiat tg, heavycopper boards, hi frequency boards, hdi boards, fpc boards, rigid and flexible boards, alu base boards, impedance control boards
Services: Export
Supplier: Single-layer boards, double-layer boards, multi-layer boards, thick copper boards, high frequency board, aluminum boards, impedance boards, immersion gold boards, ultrathick boards, halogen free boards, goldfinger board, thick nickel aluminum panels, thick gold plate
Layer count:2l Base material: fr-4 Copper thickness: 1/1 oz(35/35 um) Board thickness: 1.60±0.15mm Dimension: 155.52mmx74.46mm/1up Min hole diameter: 0.40mm(16mil) Min trace width: 0.20mm(8mil) Min trace spacing: 0.15mm(6mil) Surface finishing: osp Test: fixture/flying probe Via diameter: 0.40mm(16mil) Lead time:fastest 24h, nomal 3-5wds
Layers Count:2L Base Mateial:Alu Board Thickness: 1.60±0.15mm Copper Thickness: 2/2 oz Min Hole:0.20mm(8mil) Min Trace Width: 0.5mm(19mil) Min Trace Spacing: 0.25mm(10mil) Surface Finishing: ENIG 5u' Test: Flying probe Panel Dimension: 110.00mX437.50mm/pcs Panel Method: 1up, 1*1 Lead Time:fastest 5 wds,normal 8-13wds
Part Name: ME-PCB-197-01 Layer count: 8L Material: FR4 Thickness: 1.60mm Part Size: 335* 245/1 up. Copper thickness : 1/1/1/1/1/1/1/1oz Surface: HASL Solder: Blue Silkscreen: White Special: hole copper 25um, blue solder mask
Layer count:20l Base material: fr-4 tg170 Copper thickness: all layers 2oz Board thickness: 3.2mm±0.3mm Min hole diameter: 0.50mm(19mil) Min trace width: 0.20mm(8mil) Min trace spacing: 0.20mm(8mil) Suface finishing: enig Test: flying probe Panel dimension: 106.63mmx134.42 mm Panel method: 6up, 2*3 Blind:dr1-2, dr3-4, 2 step blind vias Via diameter: 0.5mm(19mil) Lead time:fastest 10wds, normal 15-20 wds
Layers count:4l Base mateial: iteq tg180 Board thickness: 1.60±0.15mm Min hole: 0.20mm(8mil) Min trace width: 0.089mm(3.5mil) Min trace spacing: 0.094mm(3.7mil) Surface finishing: enig Test: flying probe Panel dimension: 157.00mmx409.55mm/pcs Panel method: 1up, 1*1 Lead time:fastest 3wds, normal 5-7wds
Supplier: Layer printed circuit boards rigid, rigid flex, back planes, high frequency board, controlled impedance bga blind/buried via pcbs
Layer count: 6 Finishing thickness: 1.575 ¡à10%mm Minimum width/spacing: 4/4-mil Minimum via diameter: 0.2mm Surface finishing: lead-free hasl Specialty: all via are filled with copper paste Board thickness: 1.2mm Vacuum package