Quick Details Place of Origin: Liaoning, China (Mainland) Brand Name: GESP Model Number: 2 Layer Pcb Base Material: FR-4 Copper Thickness: 0.25 Oz -12 Oz Board Thickness: 1.6mm-3.2mm 0.2mm-4.5mm Min. Hole Size: 0.15mm Min. Line Width: 5mil Min. Line Spacing: 4 mil Surface Finishing: HASL/enig/OSP/immersion silver /gold finger Base Material:: FR-4,CEM-3, Roger,teflon , taconic,arlon , Metal/ceramic/aluminum base Copper Thickness:: 0.25 oz -12 oz Board Thickness:: 0.005 Certificate:: ISO/UL/RoHS/TS16949 Gold thickness:: 0.05UM V-cut Scoring:: YES Standards:: IPC Class 2, Class 3 Max. Panel Size:: 22 Impedance Control: yes Surface Finishing:: HASL Lead Free/OSP/Soft Gold/Hard Gold
6 layer hight PCB, OEM design PCB 1) Thickness: 0.1mm-5mm 2) Minimum linewidth:0.075mm/3mil 3) Minimum gap:0.065/2.8mil 4) Minimum aperture inradium:0.15mm 5) Minimum aperture external diameter:0.45mm 6) Minimum BGA:0.2mm 7) Layer 6 layers through hole non-impedance All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 10mils Copper thickness: 0.5oz
Our PCB Production Capability for your reference 1) Layer: from 1 to 20 2) Board finished thickness: 0.5-6.0mm 3) Material: FR-4,CEM-1, CEM-3, High TG, FR4 Halogen Free, etc 4) Surface finish/treatment: HASL/HASL lead free, HAL, Chemical Gold/tin, Immersion Silver/Gold/Tin, OSP, Gold plating, Hard &Soft gold, Plating tin. 5) Product range: Flex-PCB, Rigid-PCB, Flex-rigid PCB,HDI PCB ,PCB of single, Double and Multi-layers, High frequency PCB ,etc 6) Max. finished board size: Single & Double Layer:450mm*650mm Multilayer:450*500mm 7) Min. drilled hole size: 3mil(0.075mm) 8) Min. line width: 3mil(0.075mm) 9) Min. line spacing: 3mil(0.075mm) 10) Solder mask color : Green/yellow/black/white/red/blue 11) Copper thickness in hole: >20.0um (1mil) 12) Shape tolerance: plus or minus 0.13 13) Hole tolerance: PTH: plus or minus 0.076; NPTH: plus or minus 0.05 14) Certificate: UL,ISO9001,ISO14001,SGS,RoHS compliance 15) Special req. Buried and blind vias +controlled impedence +BGA 16) Profiling : Punching ,Routing ,V-CUT, Beveling. Inner: Vacuum packing/Plastic bag Outer: Standard carton packing.
Special futures Thickness: 1.6mm Application: projector or projecting apparatus Minimum trace size: 0.1mm Minimum drill: 0.15mm With blind and buried holes Layers: 1 to 28 Board finished thicknesses: 0.2 to 7.0mm Materials: FR-4, CEM-3, high Tg, halogen-free FR4 and Rogers,F4B Maximum finished board size: 580 x 900mm Minimum hole size: 4mil (0.1mm) Minimum trace width/space: 3.5/3.5mil Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP Copper thicknesses: 0.5 to 6oz Solder mask colors: green, yellow, black, white, red and blue Copper thickness in hole: >18um Inner packaging: plastic bag (vacuum packing) Outline tolerance: ¡À0.13mm Hole size tolerance: (PTH) ¡À0.076 and (NPTH) ¡À0.05mm With UL and TS16949:2002 marks Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger Profiling: punching, routing, V-cut and beveling OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided. Inner:vacuum packaging. Outer:carton.
4 Base Material Fr4 TG140 Board Thickness 1.6 mm Copper Thickness 1OZ Min. Hole Size 8mil (0.2mm) Min. Line Width/ Spacing 6mil (0.154mm)/5mil (0.125mm) Solder mask Color Green Silkscreen Color White Surface Finishing ENIG Min.Quantity of Order No MOQ Certificate UL, ISO 9001, ISO 14001 Difficulty
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1-6 layer 0.5-4oz copper HASL finish 4mil line space,hole size N/P
Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au: min. Impedance control Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Final inspection and Microsection.
