4-layers HASL board.
FR-4 Laminate 4 layer, HASL, Multilayers PCB High-Frequency PCB High Quality BGA PCB Board 4layer PCB manufacturer Model Number: 4layer Material: FR4 Tg135 Copper Thickness:1OZ Board Thikness:1.6mm Surface Finishing: HASL(LF) Min.Hole Siz:0.25MM Min Line space: 0.075mm(3mil) Min.Line Width:0.075mm(3mil) Solder mask color : Green Silk screen color: white Certificate: Rohs, ISO9001, UL Ckaging & Delivery Packaging Details Inner packing :Vacuum Package Outer packing:Standard Carton Or as customer's require Delivery Time 4-7 days after getting your payment Service we offer: PCB manufacturing electronics component sourcing PCB design Engineering service PCB Copy & Assembly Prototyping Plastics and molds Files needed for quoation: Gerber files of pcb BOM (Bill of material) A sampleï¼?if no gerberï¼? Standard Lead time For prototypes and Medium Qty Layers count PCB Prototypes Massï¼?â?¤1¼? Expedited working days Standard working days Expedited working days Standard working days 1 layer 1 working day 3 working days 3 working days 5 working days 2 layers 1 working day 5 working days 4 working days 7 working days 4 layers 2 working days 6 working days 6 working days 9 working days 6 layers 4 working days 7 working days 8 working days 11 working days 8 layers 5 working days 8 working days 9 working days 12 working days
4-layers Peelable board
Layer count: 4 Surface treatmeat: osp Soldermask color: green Silkscreen color: yellow Final board thickness: 1.60mm. Minimum line width/space: 0.10/0.12mm. Minimum via hole: 0.30mm.
Notes: - The packaging price is quoted based on¡êoSize 0.2m287;FR-4 Tg135 material; 1.0-1.6mm thickness; H-1oz copper; PTH161;Y0.3mm; 5/5mil; LF HASL; IPC class II; - Does not cover the freight cost and international bank transferring cost. The packaging price is quoted based on¡êoSize 0.2m287;FR-4 Tg135 material; 1.0-1.6mm thickness; H-1oz copper; PTH161;Y0.3mm; 5/5mil; LF HASL; IPC class II
1. Rigid PCB boards 2. Attained UL ,ISO,CQC certificate 3. IPC Class 2 standard 4. 9 working days for 4-layer board. Inner :vacuum packing/plastic bag Outer :standard carton packing.
4 layers PCB FR4 material 1.6mm board thickness 1OZ copper thickness Green soldermask White legend Immersion gold finish Seal packing
Item Details: Layers: 1~32 Board thickness : 0.1mm-7.0mm Material :FR- Rogers Max panel size : 32(800mm1200mm) Min hole size: 0.075mm Min line width : 3mil(0.075mm) Surface finish: OSP Copper thickness: 0.5-7.0OZ Soldermask: Green/Yellow/Black/White/Red/Blue Silkscreen : Red/Yellow/Black/White Min PAD: 5mil(0.13mm) Inter package: Vacuum Outer package: Carton Outline tolerance: 0.75mm Hole tolerance: PTH 0.025 Certificate : UL IATF16949 Special request: Blind hole+Gold finger + BGA Material Suppilers: Shengyi, KB, Nanya, ITEQ,etc. Electronics Circuit board PCB Assembly 1. RoHS & Lead Free 2. UL & ISO certified 3. Quality & service 4. Quick turn 5. Surface finish: Immersion Gold/HALS/OSP/Gold finger/Carbon print/Peelable mask/Plating gold 6. Solder mask colour: green/white/yellow/blue/red/black 7. Silk screen: white/black/yellow/red/blue/green 8. Applied in industrial facilities/medical facilities/consumer electronics/telecommunications/power supply We deliver services, not only products. We offer solutions, not only goods. Deliver Time For PCB & PCBA 1. PCB production time: sample: 3-4 days / production: within 7 days 2. Fast pcb delivery: 24 hours for 2L ; 48 hours for 4L ; 72 hours for 6L. 3. Component purchase: 2 days if all components is available in our domestic market. 4. PCB Assembly: samples: within 8 days / mass production: within 12 days LAYER PROTOTYPE MASS PRODUCTION (above 20 m2) One-stop Service Include: PCB Prototype Quick Turn PCB Single-Sided PCB Double-Sided PCB Multilayer PCB Rigid PCB Flexible PCB Rigid-Flex PCB LED PCB Aluminum PCB Metal Core PCB Thick Copper PCB HDI PCB BGA PCB High TG PCB PCB Stencil Impedance Control PCB PCB Assembly High-Frequency PCB Bluetooth Circuit Board Automotive PCB USB Circuit Board Halogen-Free PCB Antenna PCB
Our Product Range 4-28 layer of high-precision impedance, blind & buried layers, HDI boards, high frequency board, halogen-free boards, high-TG boards, aluminum, copper, iron base and ceramic-based circuit board, 1-6 layer flexible circuit board ( FPC) and rigid-flex flexible board, and other high-tech products. PCB Process Capability processing layers: 1- 30 layers Finished thickness: 0.008 "~ 0.24" (0.20mm ~ 6.0mm) Minimum aperture: 6mil (0.15mm) Minimum line width / spacing: 3-4 mil (0.076-0.10mm) Maximum board size: Single & Double 22 "x 43" (550 x1100mm), Multi-layer 22 "x 25" (550mm x 640mm) Impedance Control: ± 10% Surface Treatment: OSP, HASL, Electric Nickel / Gold, Chemical nickel / gold, lead-free HASL , Gold finger, immersion Silver, Immersion Tin. Base materials: FR4 ( ShengYi, KB, International), high TG (TG150, TG170), halogen-free board (Halogen-free), High frequency plate (Rogers, Teflon, Taconic), made PTFE (PTFE), AL aluminum plate (Berquist, Al-made basis), copper (Cu Base), Iron (Fe Base), Ceramic substrate (Ceramic Base)
