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Electronic Grade Silica Sol

Supplier From China
Apr-29-24

Features and Applications
High Purity: Electronic grade silica sol is produced with extremely high purity levels to minimize impurities that could adversely affect electronic components. This ensures the reliability and performance of semiconductor devices and integrated circuits.

Particle Size Control: The particle size distribution of electronic grade silica sol is tightly controlled to meet precise specifications. This uniformity is crucial for achieving consistent results in semiconductor fabrication processes such as chemical mechanical planarization (CMP) and wafer cleaning.

Surface Properties: Electronic grade silica sol is designed to have specific surface properties tailored for electronic applications. These properties may include controlled surface charge, stability, and compatibility with other process chemicals.

Polishing and Planarization: In semiconductor manufacturing, electronic grade silica sol is used in CMP slurries for polishing and planarization of silicon wafers. It helps achieve smooth and flat surfaces essential for patterning and layer deposition processes.

Dielectric Films: Electronic grade silica sol can be used to deposit thin dielectric films on semiconductor substrates through techniques such as spin coating or dip coating. These films act as insulating layers in electronic devices, providing electrical isolation between different components.

Passivation and Encapsulation: Silica sol can be employed for passivation and encapsulation of semiconductor devices to protect them from moisture, contaminants, and mechanical damage. The high purity and stability of electronic grade silica sol ensure long-term reliability and performance.

Photolithography: Electronic grade silica sol may also be utilized as a photoresist adhesion promoter or anti-reflective coating in photolithography processes. It helps enhance pattern fidelity and resolution during the fabrication of semiconductor circuits.

Wafer Cleaning: Silica sol is used in wafer cleaning processes to remove contaminants, particles, and organic residues from semiconductor surfaces. Its high purity and compatibility with other cleaning agents make it an essential component in advanced cleaning solutions.

Price and Minimum Quantity

Price: $1
MOQ: Not Specified

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Grain Size Analysis: Verifies uniform particle distribution for optimal melting.
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Secure Logistics: We ensure safe and timely delivery, maintaining product integrity throughout transportation.
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Iron Content:
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Silicon Dioxide (SiO ):
The silica content is exceptionally high, at 99.55%, indicating high purity.

Particle Size Distribution:

Particles larger than +850 micron / +18 BSS: Nil

Particles larger than +600 micron / +24 BSS: Nil

Particles at +500 micron / +30 BSS: 1.95%

Particles finer than -105 micron / -150 BSS: 0.10%

Moisture Content:
Moisture content in the sample is Nil, indicating a completely dry material.

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