Piezoresistive Wafer

Nominal Scale: 35KPa ,100KPa, 250KPa, 600KPa, 1MPa, 1.6MPa, 2.5MPa, 4MPa, 6MPa, 10MPa, 16MPa, 25MPa, 40MPa, 60MPa Overload Capacity: 2 times £íº35KPa íºC 2.5MPa£© 1.5 times (4MPa íºC 60MPa) Accuracy: ¡À0.1%F.S., ¡À0.25%F.S., ¡À0.5%F.S. Power Supply: 1mADC or 5VDC(Optional) Long Term Stability: ¡À0.2%F.S./ Y Operating temperature: -30¡æ ¡« 100¡æ Insulation resistance: £¾100M¦¸(100VDC)

Nominal Scale: 35KPa, 100PKa, 250PKa, 600KPa, 1MPa, 1.6Mpa, 2.5MPa, 6MPa, 10MPa, 25MPa, 40MPa, 60MPa Overload Capacity: 1.5 times nominal scale Accuracy: ¡À0.25%F.S., ¡À0.5%F.S. Output: 4¡«20mA Power Supply: 24VDC Operating temperature: -40¡æ¡«+120¡æ Long Term Stability: ¡À0.2%F.S./Y Compensated temperature:-30¡«80¡æ(Typical) -40¡æ¡«+100¡æ(optional) Zero Temperature Coefficient:¡À0.015%F.S./¡æ(Typical) Sensitivity Temperature Coefficient:¡À0.015%F.S./¡æ(Typical) Pressure Connection: M20¡Á1.5 Flat Diaphram Customized (Customer should provide connector drawing) Electrical Connection: Hirschmann Connector Cable Connection

Supplier: Piezoresistive wafer & die pressure sensor

Descriptions and gauge configurations Based on piezoresistive effect, bcm semiconductor strain gauges are made from p-type doped silicon wafer, and manufactured in two types: bar-type and backing-type. When gauges are made in the bar-type, they are naked gauges (sn-series), while made in the backing-type, the gauges are backed with phenolic-resin (sb-series). The semiconductor gauges are manufactured of three different dimensions ("1", "2" and "3") and the gauge leads can be finished in different lead-configuration. Illustrated on the top, are some sb-series backed-gauges of type 2 lead-configuration. Oem inner box and carton