Colloidal Silica Sol

PRODUCT NAME: COLLOIDAL SILICA Other name: SILICA SOL MODEL: JN-30 Color: Clear CAS NO. : 112926-00-8 TDS Specification: SIO2, %: 30, NA2O, %: 0.40 , PH: 9.0~10.5; Viscosity: 4.3-5.5 cp ; SP.GR: 1.19~1.21 Particle: 8~15 nm Application for investment casting, lost wax casting, refractory, water paint, concrete polishing..

SiO2% 14-16 Specific Gravity 1.08-1.09 Na2O% 0.5 PH Value 25 9-11 Viscosity(25, mPas) 6.5 Particles Size(nm) 2-7 Shelf Life 6 months application to #PulPaperMaking -improve fiber and #finesretention -improve colloidal retention -improve starch retention -improve #dewatering (#drainage, #pressing, and #drying) -improve formation -improve runnability -reduce downtime and off-quality production

Refractory fibers with Silica Sol as the main raw material are widely used as thermal insulation materials in industrial furnaces and other thermal and industrial equipment due to their excellent energy saving and high temperature resistance Other amorphous refractories and ceramic products with silica sol as a bond because they will not bring in a variety of low melting point oxides improve the use of performance and have the advantages of high release strength high temperature volume stability high temperature thermal shock resistance etc Si02 2931 Na2O 05 Specific gravity25 119121 PH value25 9105 Viscosity25 65 Particles SizeNM 1020 Shelf life 1 year appearance transparent

Supplier: Colloidal silica,silica sol

Features and Applications High Purity: Electronic grade silica sol is produced with extremely high purity levels to minimize impurities that could adversely affect electronic components. This ensures the reliability and performance of semiconductor devices and integrated circuits. Particle Size Control: The particle size distribution of electronic grade silica sol is tightly controlled to meet precise specifications. This uniformity is crucial for achieving consistent results in semiconductor fabrication processes such as chemical mechanical planarization (CMP) and wafer cleaning. Surface Properties: Electronic grade silica sol is designed to have specific surface properties tailored for electronic applications. These properties may include controlled surface charge, stability, and compatibility with other process chemicals. Polishing and Planarization: In semiconductor manufacturing, electronic grade silica sol is used in CMP slurries for polishing and planarization of silicon wafers. It helps achieve smooth and flat surfaces essential for patterning and layer deposition processes. Dielectric Films: Electronic grade silica sol can be used to deposit thin dielectric films on semiconductor substrates through techniques such as spin coating or dip coating. These films act as insulating layers in electronic devices, providing electrical isolation between different components. Passivation and Encapsulation: Silica sol can be employed for passivation and encapsulation of semiconductor devices to protect them from moisture, contaminants, and mechanical damage. The high purity and stability of electronic grade silica sol ensure long-term reliability and performance. Photolithography: Electronic grade silica sol may also be utilized as a photoresist adhesion promoter or anti-reflective coating in photolithography processes. It helps enhance pattern fidelity and resolution during the fabrication of semiconductor circuits. Wafer Cleaning: Silica sol is used in wafer cleaning processes to remove contaminants, particles, and organic residues from semiconductor surfaces. Its high purity and compatibility with other cleaning agents make it an essential component in advanced cleaning solutions.

Modified silica sol refers to a type of colloidal solution where silica nanoparticles are suspended in a liquid medium, typically water. These silica nanoparticles are modified or functionalized with various organic or inorganic compounds to alter their surface properties and enhance their performance in different applications. The modification process can involve chemically bonding organic molecules to the surface of the silica particles, which can impart specific functionalities such as hydrophobicity, oleophobicity, or compatibility with certain polymers or solvents. Inorganic modifications may include incorporating metal oxides or other nanoparticles to enhance properties like catalytic activity or mechanical strength. Modified silica sols find widespread use in various industries such as coatings, adhesives, sealants, composites, and catalysts. They offer advantages like improved dispersion, adhesion, and compatibility, making them valuable additives in many formulations.

Supplier: Colloidal silica, silica sol

Hydrophobic colloidal silica refers to silica nanoparticles that have been chemically modified to repel water. Colloidal silica consists of tiny particles of silicon dioxide suspended in a liquid. These particles are so small that they remain dispersed rather than settling out of solution. Applications Coatings and paints: Hydrophobic colloidal silica can be used as an additive to improve the water resistance and durability of coatings and paints. It helps prevent moisture from penetrating the surface, thereby enhancing the protective properties of the coating. Rheology modifiers: Hydrophobic colloidal silica can be incorporated into various formulations to control rheological properties such as viscosity and thixotropy. This is particularly useful in industries such as cosmetics, adhesives, and printing inks. Catalyst supports: Hydrophobic colloidal silica can serve as a support material for catalysts in chemical reactions. The hydrophobic surface helps prevent unwanted interactions with water, allowing the catalyst to remain active for longer periods. Pharmaceuticals: Hydrophobic colloidal silica may be used in pharmaceutical formulations to improve drug stability, control release rates, and enhance bioavailability.

PRODUCT NAME: COLLOIDAL SILICA Other name: SILICA SOL MODEL: JN-30 Color: Clear CAS NO. : 112926-00-8 TDS Specification: SIO2, %: 20-40% NA2O, %: 0.40 , PH: 9.0~10.5 Viscosity : 4.3-5.5 cp ; SP.GR: 1.19~1.21, 1.29~1.31 Particle Size: 8~15 nm Application for investment casting, lost wax casting, refractory, water paint, concrete polishing..