Bga Solder Ball

WDS-700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after-sales service and rework. How to separate BGA chip from motherboard / How to replace a new BGA chip Repair steps 1.Separate the BGA chip from mother board -we called desoldering 2.Clean Pad 3.Reballing or replace a new BGA chip directly 4.lignment/Positioning -Depend on experience ,silk frame ,optical camera 5.replace a new BGA chip - we called Soldering

Atten ST-2090D 80W Thermostatic Digital Rapid Heating Welding Rework Station Soldering Iron Kit with Soldering Wire Holder, ATTEN ST-2090D Multi-function Digital Thermostatic 80W Lead-free Original Soldering Station for Cellphone BGA SMD PCB IC Repair. Features: Max Power of 80 W, soldering iron 28 V AC Temperature read out in MCU controlled temperature calibration. Soldering station with solder wire stand. Auto-standby, Auto-shutdown function are available. Heating wire and sensor use PTC materials. Soldering tip designed separate from heater and using common T900 series to save use-cost. Very fast heating: from room temperature to 350 C only approx. 15 s Soldering iron with flexible connection cable Adjustable temperature range 80 - 480 C Specification: Model: ST-2090D Power consumption: 80W Input voltage: AC 220V Output voltage: AC 24V Display method: LED Temperature range: 80~480 (176 896) Temperature offset range: 50 (90) Temperature stability: 2 at idle temperature Tip to ground resistance:

ATTEN MS-300 3 IN 1 BGA Soldering Rework Station: APS1503 dc power supply 15V 3A, ST-862D hot air gun, ST-965 soldering iron. ATTEN MS-300 combination maintenance system for soldering / desoldering / dc power supply repair working. ATTEN ST-965 Soldering Station Features : Automatic standby, shutdown with smart time setting. Beep alarm function available. Temperature locking, temperature calibration and temperature alarming function. Password protecting function and temperature unite switching function MCU controlled temperature calibration. New design with LCD display screen making control visualization. Buttons ( 1, 2, 3 ) for pre-setting or switching frequently used temperature Hot Air Station ( ATTEN ST-862D ) LCD display screen making control visualization. Temperature unite switching function. Temperature locking ,timed work function. MCU controlled temperature calibration,compensation for constant working. Strong air volume with brushless fan. Easy to replace with pluggable heater. Convertible with straight air and spiral air. Auto-sleep function. DC Power Supply ( ATTEN APS1503 ) USB interface ,two screen to display. Controlled by MCU digital and series adjustment ,low ripple,low noise and high stability . Designed with double types of tables ,more suitable for telecommunication devices. Fast dynamic load response speed ,optimized proceed for communication equipment. Support automatically recovered overcurrent protection(OCP) and OHP. Independent USB interface ,which can provide current 2.1A output, support onvercurrent and short circuit protection.

product description Function: Laser spray ball welding realizes the solder connection between the PCB pad of the CCM module and the gold finger Application range: CCM module with PIN on one side and CCM module with PIN on both sides Performance The pad is placed at 0-90 degrees, which can be optimized according to the process and pad wettability The equipment dual-axis feeding realizes the seamless connection of camera positioning and welding operations, and realizes the high-speed welding axis accuracy of dual worktables �±3UM, linear module The diameter of the solder ball is 100-760UM optional, which can meet the welding of various models of modules After the product is photographed, the feeding axis completes the Y-direction positioning compensation, and the X-direction positioning compensation is completed by the welding platform Equipped with double workbenches, one workbench for welding. Another workbench is ready to maximize welding efficiency The service life of the laser is about 3 years or 80,000 hours (first come first), the nozzle life is 400,000 times, the ball disc life is 6 months, and it is cleaned regularly. A nitrogen flow meter is added to the nitrogen inlet to monitor the nitrogen flow

Features 1 Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired 2 Suitable for LED lamp beads of tape packaging and bulk materials, also any BGA and components which are difficult to repair. 3 High solution optical alignment system, accurate LED components positioning, ensure precise mounting. 4 Optical alignment is controlled electrically, can rotate automatically 5 Mounting head built-in pressure testing device, to protect the PCB 6 Built-in infrared laser positioning, fast positioning for PCB. 7 Adopt HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running 8 Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevent PCB to turn yellow. 9 Bottom heater up and down manually, can adjust the heating height real time. 10 Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serve life 11 Human-machine interface has multiple operation mode and permission, welding, and mounting manually, easy operation. 12 High resolution touch screen, which is up to 800*600 pixel 13 Adopt joystick control for alignment system, no need setting complicated parameters 14 Adopt Delta double ball bearing flow fan for air supply no need external air source 15 Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment 16 Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC,which will close output channel and display fault condition. Protect itself automatically. Specifications Total Power Max 5300W Power AC 220V10% 50/60 Hz Top heater power 1200W Bottom heater power 1200W IR power 2700W Hot air temp. 400(Max) Preheating temp. 400Max Positioning V-groove +laser positioning + universal fixture PCB size Max 410 ,370 mm Preheaing size 370mm,270mm Chip type BGA,QGN,CSP,POP,QFN, Micro SMD,LED lamp beads Chip size Max 80,80mm Min 22 mm Dimensions L640 W630 ,H900 mm Temperature sensor 1 piece Net weight 70kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days

Feature: 1.3 independent heating system ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time. 2.Precise optical alignment system with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12 HD monitor. 3.Multi-function operation system With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. 4.Superior safety functions After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation Specification parameters 1 Total power- 5100W Max 2 Top heater power- 1200W ¡ê¡§1st heater 3 Bottom heater power -1200W ¡ê¡§2nd heater 4 3rd IR heater- 2700W (independent controlling left and right IR heaters) 5 power-AC 220V10- 50/60Hz 6 Electrical materials temperature control system Adopted Dalian University of Technology 7 Dimensions- 640,630,900mm 8 Temperature control K-type thermocouple (Closed Loop), 9 Positioning V type groove;with universal fixture 9 P C B size- Max 410 mm Min65mm 10 Available BGA chip-180mm 11 External temperature sensor1piece 12 Net weight- 65kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days

Main features 1.Embedded industrial control computer,windows system. Adopt high definition human-machine interface, PLC control, there is password protection and modify function, can show 4-6 temperature curves and store multiple sets of data, with instant curves analysis function, and analyzing and correct BGA temperature at any time; 2.For guarantee the heating effect and mounting precision, control independently the top heater and mounting heat ,adopted linear slide make X,Y,Z axis can do micro adjustment and rapid positioning;after mounted, no need to move the PCB board in the bottom area, it can heat directly when move the top heater, avoid the moving of bga placement when move the PCB. Ensured the mounting accuracy and welding effect. 3.top and bottom heaters are hot-air heating, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time, three heaters control independently. Show the heat time, temperature, and curves act, on the touch screen. 4.choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system control temperature precisely through PLC and temperature module, keep the temperature deviation at 2 degree.external temperature measuring interface check temperature precisely, achieve accurate analysis and collate the actual temperature curve. 5.V-groove PCB support, with rapid, convenient and accurate positioning, can fit for all kinds of PCB board. 6.Flexible and removable universal fixture the operator and the protective effects and no damage to the PCB board suitable for all kinds of sizes of BGA repair. 7.Adopted all kinds of BGA nozzles, with 360,227; rotation, easy for installation and replacement, customized is available; 8.Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, can adjust the clearness of the image by hand or automatic. 9.The X, Y axis and R angle with micrometer adjust; alignment accuracy is within0.01mm, with high definition HD monitor, avoiding human operation errors completely. 10.There are 8 segments rising temperature and 8 constant temperatures, can store millions of temperature curves, curve analyze, set and modify on the touch screen. 11.With voice control ãalarm in advance .À function, 5-10 seconds before finished soldering and desoldering alarm the operators with voice control to prepare the related works. Powerful cross-flow fan cool the PCB board fast by hand or automatic after desoldering and soldering, it can prevent the PCB board from deformation, ensure the welding effect. 12.With vacuum pump,|¦Ìangle 60 rotation, micrometer precise adjust mounting and nozzle, need no air source. 13.With CE certification, there is emergency stop switch and automatic cut off protective device when abnormal situation happen. Specifications and technical parameters: 1 Total Power-4850W 2 Top heater-800W 3 Bottom heate-The second heat area 1200w, the third heat area 2700w (plus size area to suit any kinds of PCB board) 4 Power-AC220V 50/60Hz 5 Dimensions-L790W640H800 mm 6 Positioning-V-groove, PCB support can X,Y axis adjust at any direction, additional with universal fixture 7 Temperature control-K Sensor, Closed loop 8 Temperature accuracy-2 degree 9 PCB size-Max 370 x 410mm Min 22 x 22mm 10 Work bench fine-tuning-front and back 15mm, right and left 15mm 11 Camera magnification10x-100x times 12 BGA chip2*2-80*80mm 13 Minimum chip spacing-0.15mm 14 External Temperature Sensor1-5 pieces available to choose, optional 15 Placement Accuracy-0.01MM 16 Net weight-93kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days

WDS-620 hot selling auto laptop mobile phone playstation TV motherboard repair machine https://youtu.be/K5aGW60I6vE Independent 3 heating zones temperature control system 1.The upper and lower hot air heating,which can heat up at the same time from the top of he component to the bottom of the PCB;bottom IR heating,temperature precision control within ±1â??.8 segment temperature control independently. 2.Hot air district heating for BGA and PCB at the same time,and large area IR heater preheating up for the bottom of PCB to avoid completely PCB deformation during reworking,the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element. 3.Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system;4 temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved;temperature can be tested precisely through external measurement interface,curves can be analysedã?�set and correct on the touch screen at any time. Precision optical alignment system Using HD and adjustable CCD color optical alignment system,beam splitã?�amplificationã?�lesseningã?�fine adjustment and auto focus with the function that automatic color aberration resolution and brightness adjustment,adjustable image contrast;equipped with 15 â?� high definition LCD monitor. Multi-functional and humanized operation system 1.Adopting the HD touch human-machine interface;upper heating head and mounting head designed 2 in 1;providing many kinds of titanium alloy BGA tuyere can be rotated in 360 degree for easy installation and replacement. 2.Xã?�Y and R angle adopted micrometer fine-tuning,accuracy locating,precision can reach ±0.01mm. Superior safety protection function With the alarm function, after the BGA welding the machine can alarm by itself.In the case of temperature abuse, the circuit can power off automatically with the double over-temperature protection.Temperature parameter having password protection to prevent any modification. Higher automatic function Newest WDS-620 is the updated system with 5 modes.Itâ??s Remove,Mount,Weld,Manual and Semi-auto.The mode can be changed freely.It can be used under automatic,semi-auto & manual mode. Technology parameter 1Power supply:AC 110V/220V±10 50/60Hz 2Total power:Max 5300W 3Heater power:Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W 4Electrical material :Driving motor+PLC smart temp.controller+color touch screen 5Temperature controlling:high precision K-sensorClosed Loop),independent temp.controller,the precision can reach ±1 6Locating way:V shape slot,PCB support jigs can adjust,laser light do fast centering and position 7PCB size:Max 410*380mm Min 10*10 mm 8Applicable chips:Max 80*80mm Min 1*1 mm 9Overall dimension:L650 W630 H850mm 10Temperature Interface:1 pcs 11Weight of machine:60KG 12Color :White&Blue

WDS-750 higher automatic bga rework station https://youtu.be/5fbCW4nN3w4 Features of WDS-750 1.touch screen interface,heating time,heating temp,temp rise speed,cooling time,alarm advance,vacuum time are set up inside the touch screen,easy to use; 2.Panasonic PLC, independent control temperature control module,shows 3 temp curves all the time,4 independent sensors,check the temp accurately for the chip points,ensure the weld yield. 3.3 independent heating zones,each heating zone can set up the heating temp,heating time,temp rise rate;Six period of heating temperature, simulate the reflow heating mode,set up as Preheating, keeping, heating, welding, welding, cooling; 4.auto feed chip,auto pick up chip,auto belowing chip,can identify the central position automatically when optical alignment; 5.multifunction mode choice, four modes as weld,remove,mount,manual,automatic and semi-auto function,meet the various needs of the users; 6.Uses the high precision K-type thermocouple closed-loop control which is imported from USA,with the unique heating method,ensure the weld temp precision control within ±1 â?? 7.Uses imported optical alignment system,500 pixel HD camera,HDMMI HD signal output,15 inch HD LCD,high accurate micrometer X/Y/Z axis adjustment,ensure the location precision within 0.01-0.02mm; 8.The upper heating head and placement head are designed 2 in 1,different size of heating nozzles are provided,easy to remove and install,can be customized,meet the more requirement for users. 9.High automation and precision to avoid artificial error fully,can make the best repairing effect for the lead free technology,double-deck BGA,QFN,QFP,capacitance resistance and other components and parts. 10.Equipped the extra camera to obverse the solder ball melting,to ensure the temp curve and weld effect(this function is optional). WDS-750 parameter Total power:6800W Upper heating power:1200W Bottom heating power:1200W Bottom IR heating power:4200W2400W is controlled Power supply:(Single Phase) AC 220V±10 50Hz Location way :Optical camera+ V-shape card slot + laser position for fast location Temperature control:High precision K sensor closed loop control,independent temperature control with ±1 â?? precision Appliance selection:High sensitive touch screen + temperature control mode +Panasonic PLC +step driver Max. PCB size:500Ã?450mm Min. PCB size:10Ã?10mm Sensor:4units Chip amplification multiple:2-30X PCB thickness:0.5-8mm Chip size :0.3*0.6mm-8cm Min. chip space:0.15mm Max. mount loading:500G Mount precision:±0.01mm Overall size :L670Ã?W780Ã?H850mm Optical camera:Can be removed front and back,left and right,prevent the dead angle Machine weight :90kg