Double Side High Tg Pcb

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High-TG PCB High Temperature PCB fr4 Material The Glass Transition Temperature (Tg) is one of the most important properties of any epoxy and is the temperature region where the polymer transitions from a hard, glassy material to a soft, rubbery material. Circuit board material must flame-resistant, it canâ??t be burned at a certain temperature and only be soften. The temperature point is called the glass transition temperature (Tg). The higher Tg point means higher temperature requirement during lamination. And the Aluminum clad Circuit Boards will be hard and crisp, which will affect hole and the electrical properties. Ordinary PCB materials at high temperatures, not only will be soften, deformation, melting and other phenomena, but also the mechanical and electrical properties decline sharply. General fr4 Tg is 130-140 centigrade, moderate Tg is greater than 150-160 centigrade, High-Tg is greater than 170 degrees. The higher of Tg, the better performance of PCB heat resistance, moisture resistance, chemical resistance, stability and other characteristics. FR4 is a code name for grade of Epoxy Glass material. Tg means Glass Transition Temperature. When the working temperature reaches to the melting point, that means the temperature exceeds the Tg value, the status of pcb material will be changed from glassy to liquid, which will affect the function of pcb. And this value is related to the stability of the pcb dimension. As usual, made with Tg â?¥ 170â?? pcb material, which is called high Tg printed circuit board. With the rapid development of the electronics industry, high Tg material is widely used in computer, communication equipment, precise apparatus and instrument and etc.

High tg pcb Base material: fr4, fr1, fr2, ceramics, aluminum, rogers, f4b, f4bk, f4bt, tp, pf, cem-1, cem-3, etc. Board thickness: 0.30 to 3.20mm (12 to 26mil) Copper thickness: 0.50 to 5 ounce Solder mask: lpi solder mask, conventional solder mask, peelable solder mask, uv solder mask Minimum line width: 0.1mm (4mil) Minimum line space: 0.1mm (4mil) Minimum hole diameter: 0.25mm (10mil) Pth hole diameter tolerance: +/-0.076mm (+/-3mil) Npth hole diameter tolerance: +/-0.03mm (+/-1.2mil) Maximum board size: 460 x 620mm (18 x 24) Board finishing type: hot air leveling, soft gold, hard gold, immersion gold, gold fingers Tg 170, packing :vacuum packing in carton

Board thickness: 0.2mm-6.0mm Laminate: fr-4, taconic, rogers, tg170, tg180, cem-1 Layers: single side, double side, multilayer Outer / inner coppers: 1/1 oz, 1/2 oz, 2/2 oz, 2 oz, 3 oz, 4 oz. Multilayer stack up: stack up, controlled impedence. Pcb size: unit size, panel size, tooling strips, tooling holes and fudicials. Min hole size: 0.2mm (shape tolerance¡à 0.13mm, hole tolerance: pth¡à 0.075mm; npth: ¡à 0.05mm) Min line width: 0.1mm Min line spacing: 0.1mm Solder mask color: green, blue, red, black, yellow, white Legend color: white, yellow, black, blue, red Surface finished: hal(tin / lead), hal(lead free), immersion gold, immersion silver, Immersion tin, gold plated(soft gold), osp(entek). Certificate: rohs, sgs, ukas, iso14001, dnv, ul Profiling: cnc, routing, punching, beveling, v-cut, v-score, counter sink. Test: e-test, fixture, fly-test. Special technique: buried and blind vias, controlled impedance, bga. We have: Advanced equipment Reliable quality Reasonable price High output Quick delivery Unlimited ordering quantity Package: vacuum package

Double sided PCB, OSP or HASL surface finishing, Finished CU 1 oz, 1.6 mm board thickness, green glossy solder mask and white legend

Double-sided enig pcb Layer count : 2 layers Raw materials £ºfr-4 Board thickness £º 1.6mm Copper thickness : 1 oz Min trace width /space: 0.15 / 0.15 mm Min hole size £º0.2 mm Surface treatment £ºimmersion gold Solder mask: green Silkscreen: white Vacuum packing