Maximum board size
Standard: 508 x 610mm
On request: 610 x 610mm
Minimum/maximum board thickness
Standard: 0.6mm/3.0mm
On request: 0.4mm/3.2mm
Minimum finish hole size
Standard: 0.50mm
On request: 0.30mm
Maximum aspect ratio
Standard: 4:1
On request: 8:1
Minimum line width
Standard: 0.10mm
On request: 0.13mm
Minimum line pitch
Standard: 0.10mm
On request: 0.13mm
Minimum SMT device pitch
Standard: 0.45mm
On request: 0.30mm
Minimum SMT device land width
Standard: 0.254mm
On request: 0.254mm
Board flatness tolerance
Standard: 0.5-percent board diagonal
On request: 0.5 to 1-percent
Inner:vacuun packing
Outside:carton packing
1.2mm double-sided PCBs
Manufacturing Process:CNC Drilling--Pattern plating--Nickel and gold plating--
Wet film solder mask--Preflux--CNC Routing--Punching--
Carbon & Silver thru hole--Selective plating--
Hot air levelling--Panel for automation--V. Cut--E. Test
Production Capacity:
Max. Board Size-Standard: 508mm*610mm, On Request: 610mm*610mm
Min./Max. Board Thickness-Standard: 0.6mm/3.0mm, On Request: 0.4mm/3.2mm
Min. Finish Hole Size-Standard: 0.50mm, On Request: 0.30mm
Max. Aspect Ratio-Standard: (4:1), On Request: (8:1)
Min. Line Width-Standard: 0.10mm, On Request: 0.13mm
Min. Line Pitch-Standard: 0.10mm, On Request: 0.13mm
Min. SMT Device Pitch-Standard: 0.45mm, On Request: 0.30mm
Min. SMT Device Land Width-Standard: 0.254mm, On Request: 0.254mm
Board Flatness Tolerance-Standard: 0.5% Board diagonal, On Request: 0.5%-1%
Inner:vacuum packing
Outside:carton packing
