Characteristic Capability
Production Capacity 800,000 sq.ft/Month
Layer(mass production) 1 to 24 Layers
Max Panel Size 450*660mm
Base Copper Thickness 1/3 OZ --5 OZ
Impedance Control +/-8%
Board ThicknessImpedance Control Min:6mil(0.15mm)
Max:280mil(7mm)
Blind/Buried hole YES
Drilling (Minimum size) Mechanical drilling 8mil(0.2mm)
Laser drilling 4mil(0.1mm)
Inner Etching Minimum line/Space(A/W) 2.5mil(0.0625mm)
Line Width Tolerance +/-8%
Board Thickness(min) 2.5mil(0.625mm)
Plating Hole Minimum Hole Size 6mil (0.15mm)
Aspect Ratio (max) 12:01
Position Accuracy +/-1.8mil(0.045mm)
Microvia Minimum Hole Size 3mil(0.075mm)
Aspect Ratio (max) 1:01
Outer Etching Minimum Width /Space 2.5mil(0.05mm)
Line Width Tolerance +/-0.4mil(0.01mm)
Solder Mask Bridge 3.0mil(0.075mm)
Position Accuracy 1.5mil(0.0375mm)
Selective Gold Plating Gold Thickness 100u ís (2.5um)
Press Thickness Tolerance 8%
Wrap/Twist 0.70%
Inner Opening (min) (1) 4/L:5mil(0.125mm)
(2) 6/L-8/L:6mil(0.15mm)
(3) 8/L or above:8mil(0.2mm)
Lead Time sample S/D L:3days;4-8L:5-15days
mass productioníí S/D L:5days;4-8L:10-25days
Base Material Special Technology Surface Finish
CEM-1/CEM-3/FR-4 FR4(Halogen free)
High-speed & high-frequency material
High Tg/CTI material
Al-base
PTFE,Rogers,Getek,BT,Polyimide
blind hole PCB
buried resistor PCB
laser-drill HDI PCB
mix-material PCB
Plating edge PCB
buried via PCB
impedance control PCB
heavy Cu PCB (5oz)
Counter-Sink PCB
; HASL &Lead Free HASL
Chem. Ni/Au
Chem. Tin
Ni/Au plating
Flash Gold
Gold finger
OSP &F2
Chem. Silver
