Lyers count:2L
base mateial: HF Base Material
board thickness: 4.00±0.20mm
min hole: 0.50mm(19mil)surface finishing: ENIG
test: flying probepanel dimension: 90.00mmX90.00mm/pcs panel method: 1up, 1*1
lead time:fastest 3wds,normal 10wds
layer count:20L
base material: FR-4 TG170
copper thickness: all layers 2OZ
board thickness: 3.2mm±0.3mm
min hole diameter: 0.50mm(19mil)
min trace width: 0.20mm(8mil)
min trace spacing: 0.20mm(8mil)
suface finishing: ENIG
test: flying probe
panel dimension: 106.63mmX134.42 mm
panel method: 6up, 2*3
blind:dr1-2,dr3-4, 2 step blind vias
via diameter: 0.5mm(19mil)
lead time:fastest 10wds,normal 15-20 wds
Layers: 2L
Material: IT180 FR4+ALU
Thickness:0.6 mm
Copper Thickness: 1/1OZ
Board Size:85.19mm*85.19mm
Min line width/spacing:5mil/5mil
Min hole:0.4mm
Surface Finishing: Hard Gold Plating, gold thickness 0.2um
Application: Communication Equipments
Layers Count: 2L
Material: FR4
Board Thickness: 0.6mm
Min Hole: 0.2mm
Trace Width/Spacing: 4/4mil
Copper Thickness: H/H oz
Surface Finishing: Hard Gold plated, gold thickness 40um
Application: Electromechanical Equipment
Layers count:4l
Base mateial: iteq tg180
Board thickness: 1.60±0.15mm
Min hole: 0.20mm(8mil)
Min trace width: 0.089mm(3.5mil)
Min trace spacing: 0.094mm(3.7mil)
Surface finishing: enig
Test: flying probe
Panel dimension: 157.00mmx409.55mm/pcs
Panel method: 1up, 1*1
Lead time:fastest 3wds, normal 5-7wds
Material: FR-4
Thickness:2.0 mm
Size:127mm*139.7mm
Min Trace Width/Spacing: 6/6mil
Min hole:0.6mm
Surface Finishing: HASL
Impedance Control
Base material thickness:0.025mm-0.125mm
Min hole:f0.3mm
Min trace width/spacing:0.075mm
Copper thickness:0.009mm-0.01mm
Plug plating ?coverlay?soldermask