Copper Powder
We can offer fine powders with high dispersion and sharp size distribution.
â?¢(1)Thick film conductive paste (sintering /polymer type)
â?¢(2)Electrode material for LTCC / MLCC
â?¢(3)Through-hole paste
â?¢(4)Conductive adhesive
Model Name
CUSP10, CUSP15, CUSP20, CUSP25, CUSP30, CUSP40, CUSP50, CUSP55, CUSP70
Silver coated copper powder
Features : Excellent conductivity, good oxidation, heat resistance and good dispersibility.
â?¢Applications
1)Through-hole paste
2)Thick film conductive paste (sintering /polymer type)
3)Electrode material for LTCC / MLCC
4)EMI shield
5)Conductive adhesive
Spherical Type : TCSP0316, TCSP040, TCSP0415, TCSP0712, TCSP0720
Flake Type : TCFT0415, TCFL0515, TCFL0520, TCFL0525, TCFL0713, TCFL0715, TCFL0720, TCFM1010, TCFM1018
Dendrite Type : TCD0720, TCD1210, TCD3018
Copper Flake
Features : High dispersibility and uniform particle size with flake shape
â?¢(1)Thick film conductive paste (sintering /polymer type)
â?¢(2)Electrode material for LTCC / MLCC
â?¢(3)Through-hole paste
â?¢(4)Conductive adhesive
Model
CFM03, CFT0105, CFL05, CFL07, CFM07, CFM10, CFT30
